2009 International Symposium on VLSI Design, Automation and Test 2009
DOI: 10.1109/vdat.2009.5158099
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Cited by 3 publications
(1 citation statement)
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“…However, the fabrication of 3D ICs using advanced process technologies may induce extremely high‐power density leading hot spots. Consequently, the hot spots may result in degradation of performance and reliability with growth of power consumption for ICs, such as (i) increasing the delay time of ICs, (ii) increasing the probability of timing violations in ICs, (iii) increasing the error rate of memory accesses, (iv) shortening the lifetime of ICs, and (v) increasing the leakage power consumption of ICs [4, 5]. More extensive cooling devices may be needed to suppress the hot spots.…”
Section: Introductionmentioning
confidence: 99%
“…However, the fabrication of 3D ICs using advanced process technologies may induce extremely high‐power density leading hot spots. Consequently, the hot spots may result in degradation of performance and reliability with growth of power consumption for ICs, such as (i) increasing the delay time of ICs, (ii) increasing the probability of timing violations in ICs, (iii) increasing the error rate of memory accesses, (iv) shortening the lifetime of ICs, and (v) increasing the leakage power consumption of ICs [4, 5]. More extensive cooling devices may be needed to suppress the hot spots.…”
Section: Introductionmentioning
confidence: 99%