Obtaining of IB group metal films by novel electroless deposition method

Vaškelis, Algirdas; Jačiauskien, J.; Jagminien, A.; Norkus, Eugenijus

doi:10.1016/s1293-2558(02)00007-9

Cited by 16 publications

(17 citation statements)

References 11 publications

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“…The essential of reduction reaction is that hemolytic cleavage of N-H bonds of hydrazine adsorbed on the surface of copper powders is a catalytic and rate-determining step. Most investigations support the view that atomic hydrogen rather than hydrogen molecules is the real reducing agent of silver ion [7,8] . It is now known that only a few types of metals possess catalytic activity for the cleavage of N-H bonds, including Ni, Co, Pd (in alkaline condition), Pt, Ag and so on.…”

Section: As Activation Agentmentioning

confidence: 81%

Preparation of core-shell Cu-Ag bimetallic powder via electroless coating

Zhou

2009

J. Wuhan Univ. Technol.-Mat. Sci. Edit.

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A novel method of electroless silver coating on copper powders was reported, in which hydrazine was used as the reducing agent, and had some advantages such was used as inhibiting the substitution reaction and reducing consumption of copper powders. In the processes of sensitization and activation, AgNO 3 replaces the conventional PdCl 2 , which solves the impurity of bath. Oxide film on the surface of copper powders was tested by chemical analysis. Ag element tested by XRD and XRF is in the form of Ag 0 and exists on the surface of copper powders, which acts as catalyzer in reduction reaction. Morphology and composition of the coating were characterized by SEM and XRD respectively.

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Section: As Activation Agentmentioning

confidence: 81%

Preparation of core-shell Cu-Ag bimetallic powder via electroless coating

Zhou

2009

J. Wuhan Univ. Technol.-Mat. Sci. Edit.

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“…For electroless Co and Pd plating, hypophosphite plays the role of reducing agent, whereas for Cu-plating formaldehyde is used [31]. Electroless deposition of Cu, Ag and Au using cobalt(II) complexes has also been studied [32]. Moreover, Ni-coated structures can be further infiltrated by gold, silver, or other low-loss metals using simple chemical (as opposed to electrochemical) methods.…”

Section: Discussionmentioning

confidence: 99%

Fabrication and properties of metalo-dielectric photonic crystal structures for infrared spectral region

Mizeikis¹,

Juodkazis²,

Tarozaitė³

et al. 2007

Opt. Express

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Abstract:We report structural and optical properties of three-dimensional periodic metallic woodpile structures obtained by direct laser writing in dielectric photoresist SU-8 and subsequent electroless coating by a thin Ni film. Signatures of photonic stop gaps were observed in optical reflection spectra of the structures at infrared wavelengths. This study demonstrates that the combination of DLW and chemical infiltration of metals is attractive as a simple and cost-efficient method for the fabrication of metalo-dielectric photonic crystals.

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“…The laser-irradiated samples were submerged in chemical plating (electroless) baths of Cu, Ag, and Au (Table I) [5], [21]. Electrical measurements were performed on a Wentworth probe station with an LCR meter (HP 4284A equipped with a 16047A test fixture).…”

Section: Methodsmentioning

confidence: 99%

“…Gold plating was executed using a novel bath proposed in [21], where Au ions were reduced to metal by Co ions in a plating bath containing trimethylene diamine. The reaction takes place rapidly, without any incubation period.…”

Section: B Area-selective Metal Depositionmentioning

confidence: 99%

Laser-induced surface activation of LTCC materials for chemical metallization

Kordás

Pap

Saavalainen

et al. 2005

IEEE Trans. Adv. Packag.

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Low-temperature cofired ceramics (LTCCs) are mainly applied in hybrid microelectronics packaging technology, where the fabrication of metallic conductors on LTCC materials is done using various printing technologies. The conventional process is fast and cost-effective in the case of mass production, but too slow and difficult when repair and/or modifications of the circuitry are needed. Printing also fails when deposition of thin metal films on LTCC is required. Here, a simple laser-assisted process is presented, by which the surface of LTCCs can be activated for consecutive electroless chemical metal plating. The method enables the realization of thick high-conductance metallic Cu micropatterns and thin seed layers of Ag and Au, with a lateral resolution of a few tens of micrometers. The process is also suitable for 3-D-MEMS applications. A study of LTCC surfaces treated with Nd:YAG pulses is carried out using field emission scanning electron microscope (FESEM), SEM, X-ray diffraction (XRD) and Raman measurements.

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Obtaining of IB group metal films by novel electroless deposition method

Cited by 16 publications

References 11 publications

Preparation of core-shell Cu-Ag bimetallic powder via electroless coating

Preparation of core-shell Cu-Ag bimetallic powder via electroless coating

Fabrication and properties of metalo-dielectric photonic crystal structures for infrared spectral region

Laser-induced surface activation of LTCC materials for chemical metallization

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