2015
DOI: 10.1016/j.applthermaleng.2014.09.048
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Numerical study on layout of micro-channel heat sink for thermal management of electronic devices

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Cited by 88 publications
(25 citation statements)
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“…A good description of the major numerical methods is given, for example, in [1][2][3][4][5][6]. Here they allow numerical modelling of complicated physical processes [7][8][9][10][11][12][13][14][15][16][17][18][19], including multidimensional heat transfer in rectangles and cylinders [20][21][22][23]. However, proper understanding of the solutions and of the obtained results can be best done when they are obtained in analytical form.…”
Section: Introductionmentioning
confidence: 99%
“…A good description of the major numerical methods is given, for example, in [1][2][3][4][5][6]. Here they allow numerical modelling of complicated physical processes [7][8][9][10][11][12][13][14][15][16][17][18][19], including multidimensional heat transfer in rectangles and cylinders [20][21][22][23]. However, proper understanding of the solutions and of the obtained results can be best done when they are obtained in analytical form.…”
Section: Introductionmentioning
confidence: 99%
“…Saglietti et al (2017) performed adjoint optimization of the natural convection problems in the differentially heated cavity. Tigner et al (2013) and Gong et al (2015) studied the thermal management of the electronic devices.…”
Section: Frontiers In Heat and Mass Transfermentioning
confidence: 99%
“…Cuce and Cuce (2014) optimized the configurations to enhance heat transfer from a longitudinal fin exposed to natural convection and radiation. Gong et al (2015) made a numerical study on layout of micro-channel heat sink for thermal management of electronic devices. Hotta and Venkateshan (2015) developed a technique for the optimal distribution of discrete heat sources under natural convection based on artificial neural network (ANN) and genetic algorithm (GA).…”
Section: Introductionmentioning
confidence: 99%
“…They determined the optimal groove shape that maximizes the overall system performance. To improve the structures of the microchannel heat sinks for cooling the chips, Gong et al (2015) investigated the flow and heat transfer in four types of heat sinks (traditional microchannel heat sink, rectangular column fin heat sink, singlehole jet-cooling heat sink and double-layer microchannel heat sink), numerically. The results showed that the arrangement optimization of the microchannel heat sinks can improve the thermal performance of the inlet header by boosting the flow distribution uniformity.…”
Section: Introductionmentioning
confidence: 99%