Numerical and Experimental Study on Cooling High Power Chips of Date Centers Using  Double-Side Cooling Module Based on Mini-Channel Heat Sink

Deng, Zongquan; Zhang, Shunlu; Ma, Kefan; Jia, Chunbo; Sun, Yan; Luo, Yi; Chen, Xu; Li, Baofeng; Li, Tiejun

doi:10.2139/ssrn.4251109

SSRN Journal

2022

DOI: 10.2139/ssrn.4251109

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Numerical and Experimental Study on Cooling High Power Chips of Date Centers Using Double-Side Cooling Module Based on Mini-Channel Heat Sink

Zongquan Deng¹,

Shunlu Zhang²,

Kefan Ma³

et al.

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Numerical and Experimental Study on Cooling High Power Chips of Date Centers Using Double-Side Cooling Module Based on Mini-Channel Heat Sink

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