2007
DOI: 10.1016/j.finel.2007.06.003
|View full text |Cite
|
Sign up to set email alerts
|

Numerical analysis of fracture mechanisms and failure modes in bi-layered structural components

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1

Citation Types

0
11
0

Year Published

2008
2008
2018
2018

Publication Types

Select...
7

Relationship

3
4

Authors

Journals

citations
Cited by 14 publications
(11 citation statements)
references
References 39 publications
(45 reference statements)
0
11
0
Order By: Relevance
“…In fact, from a theoretical point of view, the problem of residual stresses induced by a hot bonding of n material components during the fabrication process can be considered equivalent, neglecting the algebraic sign, to the problem of thermal stresses induced by a temperature increase in an already bonded multi-layered structure [30]. As a consequence, the problem of residual stresses induced in the elements by a temperature increase T can be studied as a problem of thermal stresses due to a temperature decrease of the same amount.…”
Section: Resultsmentioning
confidence: 99%
“…In fact, from a theoretical point of view, the problem of residual stresses induced by a hot bonding of n material components during the fabrication process can be considered equivalent, neglecting the algebraic sign, to the problem of thermal stresses induced by a temperature increase in an already bonded multi-layered structure [30]. As a consequence, the problem of residual stresses induced in the elements by a temperature increase T can be studied as a problem of thermal stresses due to a temperature decrease of the same amount.…”
Section: Resultsmentioning
confidence: 99%
“…This is for instance the case of the bit of a cutting tool, where the external layer is usually made of polycrystalline diamond (PCD) and the substrate is hardmetal. This composite structure is then joined to a steel support (for more details about geometry and material properties, please refer to [10,11]). When subjected to repeated loadings, as during cutting operations, different failure modes (micro-, meso-and macro-chipping) may occur, depending on the initiation point of a crack on the vertical side in tension.…”
Section: Fracture Mechanics Of Hierarchical Cellular Materialsmentioning
confidence: 99%
“…2. Figure 2: Sketch of a PCD bit used in cutting tools [10]. The critical impact load is denoted by Pc and different possible failure modes ranging from micro-to macro-chipping are sketched.…”
mentioning
confidence: 99%
See 1 more Smart Citation
“…The WC-Co cell boundary deflects and interrupts crack propagation and reduces the size of each individual chipped part. As a result, the macro-chipping failure mode, which involves a significant amount of material for a homogeneous PCD [4], is reduced or prevented. Hence, the reduction of the size of the chipped portions allows us to enhance the functionality of the component and to increase its service life.…”
Section: Introductionmentioning
confidence: 99%