New Vapor Cell Technology for Chip Scale Atomic Clock

Douahi, A.; Nieradko, Ł.; Beugnot, Jean‐Charles; Dziuban, Jan; Maillote, H.; Boudot, Rodolphe; Guérandel, Stéphane; Moraja, Marco; Gorecki, Christophe; Giordano, V.

doi:10.1109/freq.2007.4319031

Cited by 10 publications

(11 citation statements)

References 5 publications

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“…(Radhakrishnan and Lal 2005). For the chemical method, many reactions can be used to produce alkali metal, such as the reaction between barium azide and alkali chloride (Knappe et al 2005), the decomposition of Cs 2 CrO 4 with reducing agent (St101) under laser heating (Douahi et al 2007), the decomposition of CsN 3 under ultraviolet (Liew et al 2007) heating and electrolysis of cesium-enriched glass (Gong et al 2006). …”

Section: Atomic Vapor Cell Chipmentioning

confidence: 99%

“…Local heating by laser is also used in the atomic cavity fabrication in which the dispenser temperature is heated up to 800°C locally (Douahi 2007). It is also a way to increase the vapor density with no increasing of the whole temperature of the vapor cavity.…”

Section: Thermal Managementmentioning

confidence: 99%

“…AVCCs of different fabrication processes and structures a Glass-silicon-glass bonding AVCC(Douahi et al 2007) b Wafer level glass blown AVCC fabricated by E. Jesper Eklund et al(Eklund et al 2008) c Atomic vapor cell with integrated RF coil (a, b)…”

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confidence: 99%

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Review of atomic MEMS: driving technologies and challenges

et al. 2010

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Section: Atomic Vapor Cell Chipmentioning

confidence: 99%

Section: Thermal Managementmentioning

confidence: 99%

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Review of atomic MEMS: driving technologies and challenges

et al. 2010

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“…They confine the atoms inside bulk-micromachined silicon cavities under the atmosphere of a buffer gas. Several methods have been developed to transfer the atoms into the silicon cavities, such as direct deposition [6], thermal evaporation [7], and thermal [8], or UV dissociation [9], just to name a few. The cells are then closed by anodically bonding a glass window to the cavity and dicing the wafer chip into individual dies.…”

Section: Mems Vapor Cellsmentioning

confidence: 99%

Microfabricated Optically-Pumped Magnetometers

Knappe

2014

Cleo: 2014

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The miniaturization of atomic devices with methods lent from microelectromechanical systems (MEMS) has enabled small, low-power high-performance sensors. Pioneered by the development of the chip-scale atomic clock, the technology has advanced to gyroscopes and optically-pumped magnetometers. At the heart of each device is a MEMS alkali vapor cell. It is integrated with micro-optical components, heaters, photodiodes, and lasers in a miniature package of less than 1cm 3 . MEMS fabrication can open the door for low-cost fabrication in large quantities and make atomic sensors manufacturable with lithographically-defined precision.

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“…6,9 While not yet studied extensively, the use of such coatings is also of high interest in microfabricated alkali cells for miniature atomic clocks. 5,10,11 There are two main groups of established wall-coatings: paraffins and organosilanes. Paraffins are very efficient antirelaxation coatings but suffer from relatively low melting temperatures in the range of 70 C to 90 C with decreased performance above the melting temperature.…”

Section: Introductionmentioning

confidence: 99%

Low-temperature indium-bonded alkali vapor cell for chip-scale atomic clocks

Straessle

Pellaton

Affolderbach

et al. 2013

Journal of Applied Physics

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A low-temperature sealing technique for micro-fabricated alkali vapor cells for chip-scale atomic clock applications is developed and evaluated. A thin-film indium bonding technique was used for sealing the cells at temperatures of 140 C. These sealing temperatures are much lower than those reported for other approaches, and make the technique highly interesting for future micro-fabricated cells, using anti-relaxation wall coatings. Optical and microwave spectroscopy performed on first indium-bonded cells without wall coatings are used to evaluate the cleanliness of the process as well as a potential leak rate of the cells. Both measurements confirm a stable pressure inside the cell and therefore an excellent hermeticity of the indium bonding. The double-resonance measurements performed over several months show an upper limit for the leak rate of 1.5 Â 10 À13 mbarÁl/s. This is in agreement with additional leak-rate measurements using a membrane deflection method on indium-bonded test structures.

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New Vapor Cell Technology for Chip Scale Atomic Clock

Cited by 10 publications

References 5 publications

Review of atomic MEMS: driving technologies and challenges

Review of atomic MEMS: driving technologies and challenges

Microfabricated Optically-Pumped Magnetometers

Low-temperature indium-bonded alkali vapor cell for chip-scale atomic clocks

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