New planar nano-gauge detection microphone: analytical and numerical acoustic modeling

Guianvarc'H, Cécile; Verdot, Thierry; Czarny, Jaroslaw; Redon, Emmanuel; Ege, Kerem; Guyader, Jean‐Louis; Walther, Arnaud; Robert, P.

doi:10.1121/1.4800608

Cited by 5 publications

(5 citation statements)

References 5 publications

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“…We present here the full and detailed vibroacoustic model with analytical comparisons, extending previous contributions [24,25], where only parts of modelling process were given.…”

Section: Introductionmentioning

confidence: 75%

“…Sensitivity at 1 kHz is 5.6 mV/Pa. The numerical and analytical lumped models [24], [26] give similar responses for the whole bandwidth. In these models the mechanical behavior of the beam is governed with the same analytical approach, however the acoustic models differ and is more precise in case of FEM.…”

Section: Approximate Form Of Sensitivitymentioning

confidence: 94%

“…In the following, we present results obtained from the finite element model previously detailed and analytical results from a lumped model [24], [26].…”

Section: Approximate Form Of Sensitivitymentioning

confidence: 99%

See 2 more Smart Citations

Microphone with Planar Nano-Gauge Detection: Fluid-Structure Coupling Including Thermoviscous Effects

Verdot¹,

Redon²,

Ege³

et al. 2016

Acta Acustica united with Acustica

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To cite this version:Thierry Verdot, Emmanuel Redon, Kerem Ege, Jaroslaw Czarny, Cécile Guianvarc'H, et al.. Microphone with planar nano-gauge detection: fluid-structure coupling including thermoviscous effects. Acta Acustica united with Acustica, Hirzel Verlag, 2016, 102 (3) AbstractThis article presents the modeling of a MEMS microphone with an original architecture formed of mechanical structures moving in the plane of the substrate. On the contrary of most microphones generally constituted of an oscillating membrane, some transducers developed by the CEA-LETI with M&NEMS technology use micro beams moving in the plane of the silicon wafer under the effect of an acoustical wave. These micro-structures are connected to the substrate by flexible micro-hinge and strain silicon nano-gauge producing a variation in resistance by piezoresistive effect. After the description of the design and functioning of the microphone under study, the vibroacoustic model of the fluid-structure coupling is presented. Considering the dimensions of the MEMS transducer close to the thermal and viscous boundary layers thicknesses, this model has to include diffusion phenomena. The model is discretized using the finite element method and the weak formulation is implemented using COMSOL Multiphysics® software. The pressure sensitivity of the microphone is calculated and compared with an analytical lumped model to asses the numerical model. Pressure and velocity fileds are also computed. Solutions of simulations are interpreted by focusing on phenomena influencing the sensitivity of this novel sensor design. In particular, the influence of the geometry and the role of the different part of the transducer (back cavity, mechanical structures) are studied.

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“…We present here the full and detailed vibroacoustic model with analytical comparisons, extending previous contributions [24,25], where only parts of modelling process were given.…”

Section: Introductionmentioning

confidence: 75%

Section: Approximate Form Of Sensitivitymentioning

confidence: 94%

See 1 more Smart Citation

Microphone with Planar Nano-Gauge Detection: Fluid-Structure Coupling Including Thermoviscous Effects

Verdot¹,

Redon²,

Ege³

et al. 2016

Acta Acustica united with Acustica

Self Cite

View full text Add to dashboard Cite

show abstract

“…In another effort, the effect of viscous turbulent perturbations at discontinuities is studied via analytical and computational techniques yielding a promising performance evaluation tool for the sensitivity and resolution of planar microphones. [ 134 ] The acoustic behavior of a similar architecture is also inspected by a vibroacoustic model based on the full linearized Navier–Stokes equations. It is found that the volume of the back cavity is the most critical parameter that affects the sensitivity.…”

Section: Applications and Devicesmentioning

confidence: 99%

Silicon Nanowires Driving Miniaturization of Microelectromechanical Systems Physical Sensors: A Review

et al. 2023

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The miniaturization of microelectromechanical systems (MEMS) physical sensors is driven by global connectivity needs and is closely linked to emerging digital technologies and the Internet of Things. Strong technical advantages of miniaturization such as improved sensitivity, functionality, and power consumption are accompanied by significant economic benefits due to semiconductor manufacturing. Hence, the trend to produce smaller sensors and their driving force resemble very much those of the miniaturization of integrated circuits (ICs) as described by Moore's law. In this respect, with its IC‐, and MEMS‐compatibility, and scalability, the silicon nanowire is frequently employed in frontier research as the sensor building block replacing conventional sensors. The integration of the silicon nanowire with MEMS has thus generated a multiscale hybrid architecture, where the silicon nanowire serves as the piezoresistive transducer and MEMS provide an interface with external forces, such as inertial or magnetic. This approach has been reported for almost all physical sensor types over the last decade. These sensors are reviewed here with detailed classification. In each case, associated technological challenges and comparisons with conventional counterparts are provided. Future directions and opportunities are highlighted.

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“…6: pressure fluctuation of 1 Pa was set on the entrance of the sensor. To simulate a bottom-port package configuration [13], 0 Pa boundary conditions were set at the outlet vent. In order to simplify the model only one beam has been taken into account.…”

Section: B Acoustic Simulationsmentioning

confidence: 99%

New architecture of MEMS microphone for enhanced performances

Czarny

Walther

Desloges

et al. 2013

2013 International Semiconductor Conference Dresden - Grenoble (ISCDG)

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International audienceThis paper describes the conception, designs consideration and fabrication process of a novel MEMS microphone. The presented microphone not only uses a new architecture, the sensitive part being beams moving within the plane of the substrate, but also uses an innovative detection means with Silicon piezo-resistive nanogauges. Modelization will consider acoustic and mechanical interactions. Besides, at MEMS scale, accurate simulation of the sensor must take into account thermal and viscous boundary layers in acoustics, and we will show that the presented sensor takes benefit from these short scale effects, which leads to achieve theoretical resolution as low as 24dB

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New planar nano-gauge detection microphone: analytical and numerical acoustic modeling

Cited by 5 publications

References 5 publications

Microphone with Planar Nano-Gauge Detection: Fluid-Structure Coupling Including Thermoviscous Effects

Microphone with Planar Nano-Gauge Detection: Fluid-Structure Coupling Including Thermoviscous Effects

Silicon Nanowires Driving Miniaturization of Microelectromechanical Systems Physical Sensors: A Review

New architecture of MEMS microphone for enhanced performances

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