Herein, the lead-free halide perovskite films with different
Cu-to-Ag
ratios (Cu3–x
Ag
x
SbI6, x = 0, 1, 2, or 3) have
been prepared by a spin-coating method at low temperature. The enhanced
resistive switching (RS) performance of more uniform SET/RESET voltages
and the endurance up to at least 1600 cycles are found in the RS memory
with a device structure of Ag/PMMA/Cu2AgSbI6/ITO. The device performance is not degraded under different bending
angles and after 103 bending cycles, which is beneficial
for flexible memory applications. The appropriately increased activation
energy of the perovskites with the partial substitution of Ag atoms,
which would lead to a more robust filament formed, is proposed to
explain the enhanced RS mechanism. Importantly, the effective size
and number of filaments measured by conductive AFM are introduced
to confirm the multilevel storage effect of Cu2AgSbI6. The multilevel storage characteristics with four resistance
levels are demonstrated by various compliance currents. Moreover,
the Cu2AgSbI6 memory devices still exhibit enhanced
RS properties and multilevel storage after 75 days of exposure to
ambient conditions. Our study provides a strategy for improving the
stability and high-density storage applications of halide perovskite
RS memory devices.