Network on interconnect fabric

Silicon interconnect fabric (Si-IF) is a wafer-scale heterogeneous integration platform. This platform promotes a paradigm shift in system integration and packaging methods, providing a single hierarchy of integration between the dies and the platform. The Si-IF effectively replaces the interposer, package, and printed circuit board. A power delivery methodology for high power wafer-scale systems (expected to dissipate up to 50 kW of power) is proposed in this paper. The proposed methodology includes three distinct power distribution topologies that are compared in terms of power loss, thermal consideration, and manufacturability. Compatible applications for each topology are also discussed. The electrical model, IR drop, and Ldi/dt noise, of each power distribution topology, are extracted and compared. Assuming a load voltage of 1 V, the three topologies exhibit a total voltage drop of, respectively, 16.68 mV, 9.62 mV, and 12.28 mV, corresponding to, respectively, 1.67%, 0.96%, and 1.23%. Hierarchical integration of decoupling capacitors is also described to ensure low voltage ripple (<5%) at the point of load. The electrical models of the power distribution topologies are verified using FEM and SPICE simulations.

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“…The FDs perform the intended function of the system on the Si-IF. The UDs are nodes within a network on interconnect fabric (NoIF) [18].…”

Section: B Backside Power Deliverymentioning

confidence: 99%

Power Delivery for Silicon Interconnect Fabric

Safari

Vaisband

2021

2021 IEEE International Symposium on Circuits and Systems (ISCAS)

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Wafer‐Scale Integration

Safari¹,

Vaisband²

2022

Wiley Encyclopedia of Electrical and Electronics Engineering

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The key challenges of on‐chip integration, including limited scalability, high cost, difficulty to maintain profitable yield, and increased thermal management complexity, suggest that additional avenues for scaling should be explored. Wafer‐scale integration is the extension of the system‐on‐chip approach to ultralarge systems. A comprehensive review of this transition from the standpoint of packaging, thermal management, and system integration is presented in this article. The benefits and challenges of wafer‐scale integration are discussed. Silicon interconnect fabric, a promising platform for high‐performance heterogeneous wafer‐scale integration, is introduced.

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Heterogeneous Integration at Scale

Iyer¹,

Vaisband²

2022

Advances in Semiconductor Technologies

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Network on interconnect fabric

Cited by 8 publications

References 15 publications

Power Delivery for Silicon Interconnect Fabric

Power Delivery for Silicon Interconnect Fabric

Wafer‐Scale Integration

Heterogeneous Integration at Scale

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