2014
DOI: 10.1021/nl501411g
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Nanoplatelet Size to Control the Alignment and Thermal Conductivity in Copper–Graphite Composites

Abstract: A controlled alignment of graphite nanoplatelets in a composite matrix will allow developing materials with tailored thermal properties. Achieving a high degree of alignment in a reproducible way, however, remains challenging. Here we demonstrate the alignment of graphite nanoplatelets in copper composites produced via high-energy ball milling and spark plasma sintering. The orientation of the nanoplatelets in the copper matrix is verified by polarized Raman scattering and electron microscopy showing an increa… Show more

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Cited by 125 publications
(63 citation statements)
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References 28 publications
(39 reference statements)
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“…As shown in Fig. 4, the anisotropy factor of thermal conductivity linearly increases with increasing BN concentration (AF = 0.20V f + 1.02), and the same phenomena have been reported for copper/GNPs composites [58]. The significant improvement of thermal conductivity and high value of anisotropy factor (9.62 when the loading of BN is 43.75 vol%) is the result of perfect alignment of BN flakes in the matrix (Fig.…”
Section: Resultssupporting
confidence: 75%
“…As shown in Fig. 4, the anisotropy factor of thermal conductivity linearly increases with increasing BN concentration (AF = 0.20V f + 1.02), and the same phenomena have been reported for copper/GNPs composites [58]. The significant improvement of thermal conductivity and high value of anisotropy factor (9.62 when the loading of BN is 43.75 vol%) is the result of perfect alignment of BN flakes in the matrix (Fig.…”
Section: Resultssupporting
confidence: 75%
“…Few copper–graphite samples were prepared for the Brinell hardness measurements (Section 2.4) according to the parameters described by Firkowska et al [12]. The uniaxial pressure during SPS orients the graphite flakes in the composites (see Abstract Figure), giving rise to anisotropic properties [17]. We define the direction parallel to the flakes and perpendicular to the pressing axis as in - plane, the direction parallel to the pressing and perpendicular to the flakes as through - plane.…”
Section: Methodsmentioning
confidence: 99%
“…However, these nanoparticles require inclusion of about 50-70 vol.% filler to attain thermal conductivity values ranging from 1 to 5 W/m K (Hou et al 2015). Hence, one of the challenges encountered in packaging of semiconductor electronic equipment is the rapid increase in operational power of the devices (Boden et al 2014). Thus, the ability to balance the dimensional reduction of semiconductors with the operational efficiency of these devices has continued to constitute challenges.…”
Section: Introductionmentioning
confidence: 99%
“…A polymer matrix filled with thermally conducting organic or inorganic fillers with dimensions in nanoscale levels is a nanocomposite suitable for thermal interface applications (Hou et al 2015, Kamseu et al 2015. Thus, PNCs with superior heat dissipation possess great potentials for application in microelectronics as TIMs (Boden et al 2014).…”
Section: Introductionmentioning
confidence: 99%