Multi-physics simulation of metal printing at micro/nanoscale using meniscus-confined electrodeposition: Effect of nozzle speed and diameter

Abstract

Meniscus-confined electrodeposition (MCED) is a solution-based, room temperature process for 3D printing of metals at micro/nanoscale. In this process, a meniscus (liquid bridge or capillary) between a nozzle and a substrate governs the localized electrodeposition process, which involves multiple physics of electrodeposition, fluid dynamics, mass, and heat transfer. We have developed a multiphysics finite element (FE) model to investigate the effects of nozzle speed (vN) and nozzle diameter (D0) in the MCED process. The simulation results are validated with experimental data. Based on theoretical approach and experimental observation, the diameter of the deposited wire is in the range of 0.5–0.9 times of the nozzle diameter. The applicable range for vN for various nozzle diameters is computed. The results showed that the contribution of migration flux to total flux remains nearly constant (∼50%) for all values of pipette diameter in the range examined (100 nm–5 μm), whereas the contribution of diffusion and evaporation fluxes to total flux increase and decrease with the increasing pipette diameter, respectively. Results of this multiphysics study can be used to guide the experiment for optimal process conditions.

Large‐Scale Micropillar 3D Patterning with High‐Aspect Ratio Using a Theta‐Pipette

“…As the deposition process proceeds, the growth front of the cathode moves in the vertical direction. [ 31 ] The growth rate is expressed as the following expression.where i is the charge transfer current or the local current on the electrode surface, M is the molar mass of copper, ρ is the density of copper, is the diameter of the deposited copper micropillar, and n is the number of electrons necessary for ion reduction.…”

“…2) During the upward motion of the probe tip, morphological changes in the droplet will cause forced convection between the solution in the droplet and the meniscus droplet, which will then cause the deposition current to fluctuate. [ 31 ] According Equation () and the results of numerical simulation, the deposition current can be adjusted by varying the potential . Therefore, according to the Equation (), this article proposes an incomplete differential proportional‐integral‐derivative (PID) closed‐loop control method that varies between the two electrodes in the theta‐pipette to adjust the Cu 2+ electromigration flux from the right pipette to the meniscus droplet used to perform electrodeposition.…”

Development of a Cone CVT by SDPD and Topology Optimization

“…Scholars have tried to avoid/diminish these defects by controlling the controllable process parameters such as laser specifications or control the fabrication signatures such as melting pool specifications during the fabrication process [20,29]. A number of scholars also attempted to derive the optimized process parameters even before printing a part by studying the effects of different parameters on the fabrication process through multi-physics simulation of the printing process [30,31]. This paper studied the theoretical aspects and the design possibilities of the new cone CVT.…”

Study of Microscale Meniscus Confined Electrodeposition Based on COMSOL

“…Morsali et al developed a Multiphysics finite element model to simulate the influence of the ambient relative humidity, nozzle speed, and diameter on the meniscus confined electrodeposition. They pointed out the influence of evaporation on the meniscus deposition and the pipette movement speed under various nozzle diameters [23,24]. However, the microscale meniscus electrodeposition is affected by the electrolyte concentration, the voltage, and the ambient relative humidity.…”