Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics with a Hot Spot

Reddy, Sohail R.; Abdoli, Abas; Dulikravich, George S.; Pacheco, César C.; Vasquez, Genesis; Jha, Rajesh; Colaço, Marcelo J.; Orlande, Helcio R. B.

doi:10.1080/01457632.2016.1242953

Cited by 29 publications

(11 citation statements)

References 13 publications

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“…An average coolant speed of 1 m s −1 was applied at the inlet and an absolute pressure of 120 kPa was applied at the outlet. A uniform heat flux of 350 W cm −2 was imposed on the top surface of the configuration [5,6], while all other sides were thermally insulated. Temperature of the liquid coolant (pure water) at inlet was 30°C.…”

Section: Case 3: Stagnant Water Effect On Electromagnetic Fieldsmentioning

confidence: 99%

“…In a recent study, Abdoli et al [5] performed 3D thermo-fluid-stress analyses using different shapes for TSV cross sections to improve the heat transfer and reduce required pumping power. Later, Reddy et al [6] applied multi-objective optimization techniques to find the optimal micro pinfin cooling configurations for high heat flux chips with a hot spot.…”

Section: Introductionmentioning

confidence: 99%

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Effect of cooling fluids on high frequency electric and magnetic fields in microelectronic systems with integrated TSVs

Abdoli

Reddy

Dulikravich

et al. 2017

Microelectronics Journal

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A B S T R A C TA fully 3D conjugate numerical analysis was performed to reveal the effects of air, R134a refrigerant and water on electromagnetic fields of electronic cooling designs made of arrays of micro pin-fins with integrated Through-Silicon-Vias (TSVs). The integrated TSV cooling configuration included 8 cylindrical TSVs with 150 µm diameter each and 200 µm height. The external dimensions of the silicon substrate were 900×700×280 µm. Each TSV encapsulated four equally spaced copper vias each having a diameter of 40 µm. The impacts of the presence of the stationary cooling fluids without heat transfer on TSVs electric and magnetic fields were examined for five different frequencies; 100 MHz, 500 MHz, 1 GHz, 5 GHz and 10 GHz. Then, separately, the effects of moving cooling water with temperature-dependent physical properties were studied while exposing the cooled micro pin-fin array to a uniform heat flux of 500 W cm −2 . For the case of stagnant and moving cooling fluids it was found that water influences the electric field twice as much as either R134a or air and that this influence decreases only negligibly with the increase in frequency of the electric current passing through the TSVs. The influence of the presence of the stagnant and moving cooling fluids on the magnetic field is orders of magnitude smaller and reduces rapidly with the increased frequency.

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Section: Case 3: Stagnant Water Effect On Electromagnetic Fieldsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Effect of cooling fluids on high frequency electric and magnetic fields in microelectronic systems with integrated TSVs

Abdoli

Reddy

Dulikravich

et al. 2017

Microelectronics Journal

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“…Unlike the heat flux in this work which if uniform, Abdoli et al [3] applied a non-uniform heat flux featuring a hot spot. Reddy et al [15] optimized the proposed pin fin shapes for a background heat flux of 500 W cm -2 and a hot spot heat flux of 1000 W cm -2 . Figure 2 shows the three pin fin shapes considered in this study.…”

Section: Conjugate Heat Transfer Analysismentioning

confidence: 99%

Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics

Reddy

Dulikravich

2015

Volume 7B: Fluids Engineering Systems and Technologies

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The thermal management capability of various candidates of micro-pin fin arrays is investigated. An integrated circuit having a footprint of 4 × 3 mm with micro-pin fin array having circular, airfoil and convex cross-section is considered. The three pin fin cross-sections along with the cooling schemes are optimized to handle a uniform heat flux of 500 W/cm2 applied to the top surface of the electronic chip. A fully three-dimensional, steady-state conjugate heat transfer analysis was performed on each cooling configuration and a constrained multi-objective optimization was carried out for each of the three micro-pin fin shapes to find pin fin designs configurations capable of cooling such high heat fluxes. The design variables were the geometric parameters defining each pin fin cross section, height of the chip and inlet speed of the coolant. The two simultaneous objectives were to minimize maximum temperature and pressure drop (pumping power), while keeping the maximum temperature below 85°C. A response surface was constructed for each objective function and was coupled with a genetic algorithm to arrive at a Pareto frontier of the best trade-off solutions. Stress-deformation analysis incorporating the hydrodynamic and thermal loads was performed on each of the three optimized configurations. The maximum displacement was found to be on the nano-level, and the Von-Mises stress for each configuration was found to be significantly below the yield strength of Silicon.

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“…Thermal performance of cooling systems incorporating fins with various configurations was studied earlier [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17]. Although fins interrupt the flow in the cooling system, proper arrangement of fin configuration, such as non-uniform fin distribution, improves the performance of the thermal systems [1].…”

Section: Introductionmentioning

confidence: 99%

“…Fins can also be used effectively under high heat fluxes [8]. Micro-fin improves the cooling effectiveness of the surfaces subjected to high heat fluxes [9], particularly convex and hydrofoil shape fin designs contributes to cooling effectiveness. Moreover, fin arrays or micro-pillars can be used for various heating and cooling applications.…”

Section: Introductionmentioning

confidence: 99%

Influence of Hydrophobic Fin Configuration in Thermal System in Relation to Electronic Device Cooling Applications

2020

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In this study, heat and flow analysis of the cooling system incorporating fins with hydrophilic and hydrophobic wetting surfaces has been considered in relation to electronic cooling applications. Temperature and velocity fields in the solution domain are simulated for various fin numbers and sizes. A temperature parameter is introduced to assess the thermal performance of the system. Fin count is introduced to formulate the number of fins in the solution domain. The Nusselt number and pressure drop between the inlet and exit ports due to different fin configurations of the cooling system for various fin counts are presented. It is found that the temperature parameter attains high values for large sizes and small fin counts, which is more pronounced for low Reynolds numbers. Increasing number of fins results in almost uniform flow distribution among the fin, which is more pronounced for the hydrophobic fin configuration. The Nusselt number attains larger values for the hydrophilic fin configuration than that corresponding to the hydrophobic fin, and it attains a peak value for certain arrangement of fin count, which differs with the Reynolds number. The pressure drop between the inlet and exit ports reduces for hydrophobic fin; hence the slip velocity introduced for hydrophobic fin improves the pressure drop by 6% to 16% depending on the fin counts in the cooling system.

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Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics with a Hot Spot

Cited by 29 publications

References 13 publications

Effect of cooling fluids on high frequency electric and magnetic fields in microelectronic systems with integrated TSVs

Effect of cooling fluids on high frequency electric and magnetic fields in microelectronic systems with integrated TSVs

Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics

Influence of Hydrophobic Fin Configuration in Thermal System in Relation to Electronic Device Cooling Applications

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