Modelling Thermal Fatigue in Power Electronics

Dudek, R.; Döring, R.; Mathew, Anu; Otto, Alexander; Rzepka, Sven

doi:10.1109/eurosime54907.2022.9758893

Cited by 5 publications

(2 citation statements)

References 6 publications

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“…To compare these results with the experimental cycle tests, these values must be converted into "mean cycle to failure numbers." For this purpose, a Manson-Coffin approach is used, which describes the thermal fatigue [23].…”

Section: Reliability and Modeling Methodsmentioning

confidence: 99%

Sensor Systems for Extremely Harsh Environments

Kappert

Schopferer

Saeidi

et al. 2022

Journal of Microelectronics and Electronic Packaging

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Sensors are key elements for capturing environmental properties and are today indispensable in the industry for monitoring and control of industrial processes. Many applications are demanding for highly integrated intelligent sensors to meet the requirements on safety, clean, and energy-efficient operation, or to gain process information in the context of industry 4.0. While in many everyday objects highly integrated sensor systems are already state of the art, the situation in an industrial environment is clearly different. Frequently, the use of sensor systems is impossible due to the fact that the extreme ambient conditions of industrial processes like high operating temperatures or strong mechanical loads do not allow a reliable operation of sensitive electronic components. Eight Fraunhofer Institutes have bundled their competencies and have run the Fraunhofer Lighthouse Project “eHarsh” to overcome this situation. The project goal was to realize sensor systems for extremely harsh environments, whereby sensor systems are more than pure sensors, rather these are containing one or multiple sensing elements and integrated readout electronics. Various technologies, which are necessary for the realization of such sensor systems, have been identified, developed, and finally bundled in a technology platform. These technologies are, e.g., MEMS and ceramic-based sensors, SOI-CMOS-based integrated electronics, board assembly and laser-based joining technologies. All these developments have been accompanied by comprehensive tests, material characterization, and reliability simulations. Based on the platform, a pressure sensor for turbine applications has been realized to prove the performance of the eHarsh technology platform.

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Section: Reliability and Modeling Methodsmentioning

confidence: 99%

Sensor Systems for Extremely Harsh Environments

Kappert

Schopferer

Saeidi

et al. 2022

Journal of Microelectronics and Electronic Packaging

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“…In the literature, CZM has been implemented to simulate the many kinds of interfaces, including some applications related to polymers [ 8 ] and bonded joints [ 9 , 10 ]. Regarding power electronics applications, CZM has been used in copper-to-resin adhesion [ 11 ], solder joint interface delamination [ 12 ], the bonding/debonding behavior of bond pad structures [ 13 ], the debonding process of stiff film/compliant substrate systems [ 14 ], the failure mechanisms of stretchable electronics [ 15 ], the solder layer and semiconductor chip interface [ 16 ], and thermal fatigue [ 17 ], among others. Several approaches have been proposed in order to take into account the damage for fatigue loading, such as linking it to the maximum load the cycle [ 18 , 19 ] or the maximum principal strain [ 20 ] or including an unloading–reloading relation [ 21 , 22 ].…”

Section: Introductionmentioning

confidence: 99%

Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages

Mirone,

Barbagallo,

Bua

et al. 2023

Materials

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Delamination is a critical failure mode in power electronics packages that can significantly impact their reliability and performance, due to the large amounts of electrical power managed by the most recent devices which induce remarkable thermomechanical loads. The finite element (FE) simulation of this phenomenon is very challenging for the identification of the appropriate modeling tools and their subsequent calibration. In this study, we present an advanced FE modeling approach for delamination, together with fundamental guidelines to calibrate it. Considering a reference power electronics package subjected to thermomechanical loads, FE simulations with a global–local approach are proposed, also including the implementation of a bi-linear cohesive zone model (CZM) to simulate the complex interfacial behavior between the different layers of the package. A parametric study and sensitivity analysis is presented, exploring the effects of individual CZM variables on the delamination behavior, identifying the most crucial ones and accurately describing their underlying functioning. Then, this work gives valuable insights and guidelines related to advanced and aware FE simulations of delamination in power electronics packages, useful for the design and optimization of these devices to mitigate their vulnerability to thermomechanical loads.

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