A cellular automata is introduced to model the locally resolved oxide thickness, the stress, and the etching rate dynamics at the silicon electrolyte contact along a macroscopically long line (1 mm). Short‐ and long‐range interaction mechanisms are considered to achieve current oscillations. Extended chronoamperometric oscillations are obtained but finally, the oscillations become increasingly damped for the case of a locally acting stress and a locally varying etching rate. The additional incorporation of a small oscillating and long‐range interacting nominal etching rate into the model leads to sustained oscillations. (© 2009 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)