Modeling of Processes Taking Place during Powder Coating Treatment by an Electron Beam or a Plasma Jet

Abstract

This paper considers the problem of nding the temperature eld in two-layer metallic materials heated by a moving source of radiation. It describes developed by the authors numerical method for solving the problem of heating a two-layer plate by a moving axially symmetric surface heat source with regard to the function of distribution of the power density of the beam for which the program of computation in C ++ was implemented. The calculation results were used for selecting the optimal parameters (speed and power density of the source) of modifying radiation of protective powder coatings on steel substrates.

Plasma-Assisted Automated Precision Deposition of Powder Coating Multifunctional Systems

“…In our previous study the temperature distribution in the two-layer absorbers was calculated using both the permanent linear case model and the non-linear model with variable thermal parameters [12,13]. The deposition and additional treatment parameters are given in Table I.…”

“…Our previous papers [10,11] dealt with the selection of relevant * corresponding author; e-mail: dalontseva@mail.ru components for developing multifunctional powder coating systems and appropriate trajectory of the plasma source and processing modes. This was based on mathematical modelling of the optimized condition determined by our initial experimentation [12,13].…”

Developing a New Resource and Energy Saving Technology of Precision Application of Powder Coating Multifunctional Systems

“…The 100 mm thick coatings from Ni-based powders were deposited on Steel 3 substrate by MPS with the help of "MPN-004" microplasma deposition unit The modes of microplasma deposition were as follows: a laminar DC plasma jet; the Ar plasma forming and protective gas; 1-8 mm the diameter of the spray spot; 2 W the power of plasma source; 2 kg/h the powder flow rate; 0.008 m/s the travel speed of the plasma jet. The modes of additional irradiation were determined using the methodology described in our previous work [12]. This is based on the simulating temperature fields in the "coating-substrate" system when heated by a moving source of radiation.…”

The Temperature Stability of Nanometric Multilayers of Copper and Chromium–Nickel Steel (Cu/310S)

“…The physical temperature stability of coatings will depend also on the type of its bonding with the substrate (e.g., adhesion, diffusion). In the cases of the prolonged action of elevated temperature and the occurrence of diffusion phenomena, the nature of bonding with the substrate may change [6][7][8][9]. The most commonly used substrate for thin film components in microelectronics is monocrystalline silicon.…”