2014
DOI: 10.1109/tdmr.2013.2256788
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Mode Mixity Dependence of Interfacial Fracture Toughness in Organic Electronic Structures

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Cited by 7 publications
(11 citation statements)
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“…Interfacial interactions between surfaces may also increase the overall energy release rates compared to predictions from AFM calculations when higher mode mixities are present. 45 It is of interest to note that when the computed crack driving forces exceed the measured adhesion energies at crack lengths that are comparable to the range of blister/bubbles sizes (3-50 lm) observed in the specimens that were imaged during the current-voltage experiments ( Figures 10(a) and 11). This suggests that the observed blister formation is due to delamination around TiO 2 nanoparticles at the interfaces.…”
Section: E Stress Distributions and Crack Driving Forcesmentioning
confidence: 83%
“…Interfacial interactions between surfaces may also increase the overall energy release rates compared to predictions from AFM calculations when higher mode mixities are present. 45 It is of interest to note that when the computed crack driving forces exceed the measured adhesion energies at crack lengths that are comparable to the range of blister/bubbles sizes (3-50 lm) observed in the specimens that were imaged during the current-voltage experiments ( Figures 10(a) and 11). This suggests that the observed blister formation is due to delamination around TiO 2 nanoparticles at the interfaces.…”
Section: E Stress Distributions and Crack Driving Forcesmentioning
confidence: 83%
“…The sides of the specimens were coated with gold to enhance their conductivities and enable imaging in the SEM. The key features of the crack patterns were thus observed and measured, prior to incorporation into expressions for the estimation of crack-tip shielding levels from row and zone models (Tong et al, 2012).…”
Section: Interfacial Fracture Testingmentioning
confidence: 99%
“…Prior work on interfacial fracture between bi-material interfaces has explored ceramic/epoxy interfaces (Rahbar, Wolf et al, 2008) for applications in dentistry and medicine (Tong et al, 2012), (Rahbar, Yang et al, 2008), and electronics packaging (Tong et al, 2012). These have shown that the crack paths depend strongly on the ratio of the interfacial fracture toughness, to the interfacial energy release rate to the substrate fracture toughness, the substrate energy release rate (G s ) and the mode mixity/phase angle, ψ.…”
Section: Introductionmentioning
confidence: 99%
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