2014
DOI: 10.1587/transele.e97.c.923
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Millimeter-Wave GaN HEMT for Power Amplifier Applications

Abstract: SUMMARY Gallium nitride high electron mobility transistors (GaN HEMTs) were developed for millimeter-wave high power amplifier applications. The device with a gate length of 80 nm and an InAlN barrier layer exhibited high drain current of more than 1.2 A/mm and high breakdown voltage of 73 V. A cut-off frequency f T of 113 GHz and maximum oscillation frequency f max of 230 GHz were achieved. The output power density reached 1 W/mm with a linear gain of 6.4 dB at load-pull measurements at 90 GHz. And we extract… Show more

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Cited by 18 publications
(13 citation statements)
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“…19. Another novel approach is the CMOS gate driver flip-chip assembled with GaN devices together on the IPD substrate, which minimizes the parasitic effects caused by bonding wires [97]. The PCB embedded inductor is also a solution to low parasitic IPDs [98].…”
Section: Gan Power Integration Road Aheadmentioning
confidence: 99%
“…19. Another novel approach is the CMOS gate driver flip-chip assembled with GaN devices together on the IPD substrate, which minimizes the parasitic effects caused by bonding wires [97]. The PCB embedded inductor is also a solution to low parasitic IPDs [98].…”
Section: Gan Power Integration Road Aheadmentioning
confidence: 99%
“…Fig. 5 shows the equivalent circuit of the Angelov GaN HEMT model [29], [31]. Model parameters were extracted from the measured DC ID-VD and S-parameters of the fabricated HEMT.…”
Section: Millimeter-wave Gan Device Modelingmentioning
confidence: 99%
“…We extracted the VDS dependence of the output resistance RDS and the capacitance CDS in Fig. 7 from the measured S22 at 2 GHz [28] with the following simplified admittance equation:…”
Section: Millimeter-wave Gan Device Modelingmentioning
confidence: 99%
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“…The empirical modeling method has been widely used due to their excellent performance in convergence and accuracy [ 17 , 18 , 19 , 20 , 21 , 22 ]. An effective validation of large signal model is validated by on-wafer load-pull measurement [ 23 , 24 ]. However, due to the complication of load-pull measurement, only one input/output impedance is validated.…”
Section: Introductionmentioning
confidence: 99%