Mid-infrared characterization of solution-processed As_2S_3 chalcogenide glass waveguides

Tsay, Candice; Mujagić, E.; Madsen, C.K.; Gmachl, Claire F.; Arnold, Craig B.

doi:10.1364/oe.18.015523

Cited by 70 publications

(64 citation statements)

References 34 publications

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“…Although the SOI waveguides are relatively large we believe that sub dB/cm losses can be achieved by using even smaller structures such as for example LOCOS waveguides [26]. The propagation loss demonstrated here is also much lower than losses previously reported in the literature for other MIR waveguides [14,27,28].…”

Section: Resultsmentioning

confidence: 53%

Low loss silicon waveguides for the mid-infrared

et al. 2011

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Silicon-on-insulator (SOI) has been used as a platform for nearinfrared photonic devices for more than twenty years. Longer wavelengths, however, may be problematic for SOI due to higher absorption loss in silicon dioxide. In this paper we report propagation loss measurements for the longest wavelength used so far on SOI platform. We show that propagation losses of 0.6-0.7 dB/cm can be achieved at a wavelength of 3.39 µm. We also report propagation loss measurements for silicon on porous silicon (SiPSi) waveguides at the same wavelength.

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Section: Resultsmentioning

confidence: 53%

Low loss silicon waveguides for the mid-infrared

et al. 2011

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“…In addition to their exceptional optical properties, ChG's are also uniquely poised for mid-IR multimaterial photonic integration. These glasses can be deposited at high rates exceeding 100 nm/min via simple single-source thermal evaporation with the substrate held near room temperature [41] or via simple solution processing [42][43][44][45]. Combined with their amorphous nature, good van der Waals adhesion to different substrates without surface modification [46], and ease of processing [47], the extremely low thermal budget allows epitaxy-free ChG coating to form optically thick films on different substrates including silicon and III-V semiconductors, the dominant substrate platform for most mid-IR photonic devices.…”

Section: Integrated Photonics For Infrared Spectroscopic Sensingmentioning

confidence: 99%

Integrated photonics for infrared spectroscopic sensing

et al. 2017

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Infrared (IR) spectroscopy is widely recognized as a gold standard technique for chemical analysis. Traditional IR spectroscopy relies on fragile bench-top instruments located in dedicated laboratory settings, and is thus not suitable for emerging field-deployed applications such as in-line industrial process control, environmental monitoring, and point-ofcare diagnosis. Recent strides in photonic integration technologies provide a promising route towards enabling miniaturized, rugged platforms for IR spectroscopic analysis. Chalcogenide glasses, the amorphous compounds containing S, Se or Te, have stand out as a promising material for infrared photonic integration given their broadband infrared transparency and compatibility with silicon photonic integration. In this paper, we discuss our recent work exploring integrated chalcogenide glass based photonic devices for IR spectroscopic chemical analysis, including on-chip cavityenhanced chemical sensing and monolithic integration of mid-IR waveguides with photodetectors.

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“…PML is an artificial ideally absorbing layer which is used to shorten computational regions in numerical method simulation with open boundaries. To perform the FDTD simulation in a finite volume of space, the computational cell Inter Chip Distance (µm) 10 terminates with user defined boundary conditions. The computational cell is further subdivided into convex rectilinear regions.…”

Section: Fdtd Modelling Using Meepmentioning

confidence: 99%

FDTD modeling of chip-to-chip waveguide coupling via optical quilt packaging

et al. 2013

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We present Finite-Difference Time-Domain (FDTD) simulations to explore feasibility of chip-to-chip waveguide coupling via Optical Quilt Packaging (OQP). OQP is a newly proposed scheme for wide-bandwidth, highly-efficient waveguide coupling and is suitable for direct optical interconnect between semiconductor optical sources, optical waveguides, and detectors via waveguides. This approach leverages advances in quilt packaging (QP), an electronic packaging technique wherein contacts formed along the vertical faces are joined to form electrically-conductive and mechanically-stable chip-to-chip contacts. In OQP, waveguides of separate substrates are aligned with sub-micron accuracy by protruding lithographically-defined copper nodules on the side of a chip. With OQP, high efficiency chip-tochip optical coupling can be achieved by aligning waveguides of separate chips with sub-micron accuracy and reducing chip-to-chip distance. We used MEEP (MIT Electromagnetic Equation Propagation) to investigate the feasibility of OQP by calculating the optical coupling loss between butt coupled waveguides. Transmission between a typical QCL ridge waveguide and a single-mode Ge-on-Si waveguide was calculated to exceed 65% when an interchip gap of 0.5 μm and to be no worse than 20% for a gap of less than 4 μm. These results compare favorably to conventional off-chip coupling. To further increase the coupling efficiency and reduce sensitivity to alignment, we used a horn-shaped Ge-on-Si waveguide and found a 13% increase in coupling efficiency when the horn is 1.5 times wider than the wavelength and 2 times longer than the wavelength. Also when the horizontal misalignment increases, coupling loss of the horn-shaped waveguide increases at a slower rate than a ridge waveguide.

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Mid-infrared characterization of solution-processed As_2S_3 chalcogenide glass waveguides

Cited by 70 publications

References 34 publications

Low loss silicon waveguides for the mid-infrared

Low loss silicon waveguides for the mid-infrared

Integrated photonics for infrared spectroscopic sensing

FDTD modeling of chip-to-chip waveguide coupling via optical quilt packaging

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