Abstract:As the demand for advanced packaging is growing, the value of mid-end process technologies is increasing in an effort to realize innovative device products. Substrate-free packaging and 3D integration are coming with the challenges to polymer resin deposition for interlayer dielectrics films and final passivation films and their developments of process integration. For cost reduction of Fan-out Wafer Level Packaging, we have demonstrated thick film deposition on square panel substrates using the photo-sensitiv… Show more
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