Microsystems for Single‐Cell Analysis

Weiz, Sonja M.; Medina‐Sánchez, Mariana; Schmidt, Oliver G.

doi:10.1002/adbi.201700193

Cited by 22 publications

(33 citation statements)

References 246 publications

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“…Swiss‐roll 3D sensors were explored for sensing applications in a microfluidic configuration. For instance, the radial distribution of electric current in the inner channel of the Swiss‐roll architecture allows for the fabrication of highly sensitive impedance based detectors for spectroscopy (Figure c) and tomography applications with sub‐millimeter dimensions . Direct influence of the 3D shape and confinement on biological systems as well as possibilities of cell and tissue manipulation are also investigated using self‐assembled tubular and polygonal shaped structures.…”

Section: Self‐assembled Electronic Devices and Their Shapementioning

confidence: 99%

“…On top of these dielectric layers, one can form electrodes for impedance spectroscopy made of a thin Cr adhesion layer and Au conductor deposited by evaporation techniques such as e‐beam evaporation. Rolling is accomplished by the oxidation and dissolution of the Ge sacrificial layer in diluted hydrogen peroxide solution, resulting in arrays of microtubular devices that can be integrated into a PDMS chip for microfluidic applications . Mönch et al applied strain engineering using sputter deposited CuNiMn (100th of nm's) on top of a photoresist to roll up a functional nanomembrane consisting of a magnetic sensor element based on [Py/Cu] 30 multilayers to reveal the giant magnetoresistance (GMR) effect.…”

Section: Self‐assembly Driving Mechanisms and Materials Platformsmentioning

confidence: 99%

“…The mechanisms behind the self‐assembly of strained thin film bi‐ and multilayers are covered in several recent reviews, including the works of Zhang et al and Chen et al The residual strain approach has been extensively explored in studying material properties and the fundamental geometrically induced optical, magnetic, and biological effects. These development have been accompanied in recent years by the appearance of novel 3D mesoscopic electronic devices including sensors, passive electronic components, thermoelectric generators, electrochemical cells, transistors, and 3D electrodes …”

Section: Self‐assembly Driving Mechanisms and Materials Platformsmentioning

confidence: 99%

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Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

Karnaushenko

Kang

Schmidt

2019

Adv Materials Technologies

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simple transistors and logics to highly integrated microcontrollers and displays, the latter of which utilizes some of the most technologically advanced processes available in the industry. [3] The success of these technologies has been achieved through enhanced integration of various active functional blocks such as transistors, digital logics, and analog circuits, along with advances in miniaturization and simplification of the overall manufacturing process, eventually leading to large scale, parallel fabrication of silicon chip-based microelectronic components and systems. [4,5] However, many of the manufacturing steps in assembling these electronic components remain either semiparallel or sequential in nature, including processes as dicing, pick and place, packaging, and final assembly of the device. Each additional sequential step increases costs and should ideally be avoided, however substantial streamlining is not always feasible in complex manufacturing processes. [6] More critically, highly integrated silicon-based devices still require several external supporting components for their operation such as wiring, powering, sensing, and communications that cannot be easily integrated within the planar surface of a silicon die. Thus, sensors, actuators, capacitors, coils, antennas, and optics, each crucial for the complete system, are typically placed separately from the silicon chip onto a printed circuit board (PCB), or integrated within another package (Figure 1a). While the need for ever decreasing sizes has demanded tremendous investments and efforts in the manufacture of completed assemblies, the miniaturizing of 3D electronic components (Figure 1b) and systems has nevertheless reached the range of mesoscopic sizes (<1 mm) where the manufacture and assembly of components experience challenges with respect to yield, costs, and reliability. [7] As a result, these issues limit the fabrication potential and commercial viability of components and systems to scales around 1 mm, [8] and despite efforts to improve the planar construction of mesoscopic 3D devices, the results are seen as inefficient and experience difficulties in achieving high performances while maintaining reasonable complexity. Despite the great success in manufacturing active electronics, such concerns are strongly related to the fabrication of passive electronic components like inductors, capacitors, antennas, and resonators where material properties (e.g., mechanical, magnetic, and electrical) and geometry play a crucial role. [8,9] In order to downscale these devices further and improve integration with active electronics, novel fabrication strategies are required.Electronic devices and their components are continually evolving to offer improved performance, smaller sizes, lower weight, and reduced costs, often requiring the state-of-the-art manufacturing and materials to do so. An emerging class of materials and fabrication techniques inspired by self-assembling biological systems shows promise as an alternative to the more traditional m...

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Section: Self‐assembled Electronic Devices and Their Shapementioning

confidence: 99%

Section: Self‐assembly Driving Mechanisms and Materials Platformsmentioning

confidence: 99%

Section: Self‐assembly Driving Mechanisms and Materials Platformsmentioning

confidence: 99%

See 1 more Smart Citation

Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

Karnaushenko

Kang

Schmidt

2019

Adv Materials Technologies

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“…The biological sample can be detected or stimulated using electrodes integrated into the origami structure . The folded structure could conceivably be also patterned with specific magnetic, optical, or biochemical characteristics to target a unique stimulus or measure a selected response of the biosample in‐situ and with high 3D spatiotemporal resolution . Furthermore, the possibility to integrate these microstructures with other microcomponents on‐chip has allowed novel lab‐on‐a‐chip prototypes to enable sensing with high spatial resolution.…”

Section: Origami Biosensorsmentioning

confidence: 99%

“…Ger et al have demonstrated a magnetic origami biosensor self‐assembled by rolling up a magnetic film that actively attracts cells containing diluted magnetite (Fe 3 O 4 ) nanoparticles . Further electrical, photonic, and magnetic features could be potentially integrated on different sections along these rolled‐up microstructures, promoting them as lab‐in‐a‐tube biosensing devices . Elsewhere rolled‐up geometries based on polymers or rolled‐up meshes have been utilized for biosensing.…”

Section: Origami Biosensorsmentioning

confidence: 99%

Origami Biosystems: 3D Assembly Methods for Biomedical Applications

et al. 2018

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Conventional assembly of biosystems has relied on bottom‐up techniques, such as directed aggregation, or top‐down techniques, such as layer‐by‐layer integration, using advanced lithographic and additive manufacturing processes. However, these methods often fail to mimic the complex three dimensional (3D) microstructure of naturally occurring biomachinery, cells, and organisms regarding assembly throughput, precision, material heterogeneity, and resolution. Pop‐up, buckling, and self‐folding methods, reminiscent of paper origami, allow the high‐throughput assembly of static or reconfigurable biosystems of relevance to biosensors, biomicrofluidics, cell and tissue engineering, drug delivery, and minimally invasive surgery. The universal principle in these assembly methods is the engineering of intrinsic or extrinsic forces to cause local or global shape changes via bending, curving, or folding resulting in the final 3D structure. The forces can result from stresses that are engineered either during or applied externally after synthesis or fabrication. The methods facilitate the high‐throughput assembly of biosystems in simultaneously micro or nanopatterned and layered geometries that can be challenging if not impossible to assemble by alternate methods. The authors classify methods based on length scale and biologically relevant applications; examples of significant advances and future challenges are highlighted.

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3D Self‐Assembled Microelectronic Devices: Concepts, Materials, Applications

et al. 2019

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www.advmat.de www.advancedsciencenews.com photolithography techniques. New amorphous semiconducting materials are involved in the development of flexible electronics based on high-performance compounds that include organic [82] and inorganic (e.g., copper oxide [83] or indium-gallium-zinc oxide (IGZO) [84] ) semiconductor possessing, for instance, the transparency [85] required in optoelectronic applications. Once fabricated on polymeric ultrathin substrates, these devices offer the flexibility, stretchability, and imperceptibility [85][86][87] for onskin (Figure 3 a,b,d) biomedical applications, such as biosensors capable of conformally wrapping a soft or irregularly shaped 3D biological sample such as a cancer cell or a pollen grain. [88] Demonstrating outstanding mechanical stability, thin-film materials, in particular semiconductors, are superior candidates for 3D applications compared to monocrystalline semiconductors. [87,89,90] Good examples are amorphous oxides and some organic molecular semiconductors [82] (Figure 3b-d) which are particularly attractive for 3D self-assembled microelectronics. By employing substrates with a thickness in the micro-and submicrometer range (Figure 3) many issues associated with mechanical stress on the surface could be mitigated, demonstrating the increased robustness and reliability of thinfilm electronics. [87,89] Electronic skin (e-skin) (Figure 3a,b,d), for Adv. Mater. 2020, 32, 1902994 Adv. Mater. 2020, 32, 1902994 Figure 3. Thin-film flexible electronic devices and applications. a) Mechanical prosthesis with stretchable electronic skin. Adapted with permission. [97] Copyright 2014, Springer Nature. b) Schematics and photograph of imperceptible organic electronics equipped with tactile active sensor matrix. Adapted with permission. [87] Copyright 2013, Springer Nature. c) Complex circuits with 8-bit microprocessors made of 3381 organic thin-film transistors. Adapted with permission. [98] Copyright 2012, IEEE. d) Ultrathin substrate combined with high-performance indium-gallium-zinc oxide (IGZO) circuitry paving the way for active medical devices on contact lenses. [85] Adapted with permission. [85] Copyright 2014, Springer Nature.

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Microsystems for Single‐Cell Analysis

Cited by 22 publications

References 246 publications

Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

Origami Biosystems: 3D Assembly Methods for Biomedical Applications

3D Self‐Assembled Microelectronic Devices: Concepts, Materials, Applications

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