Microstructural evolution, fracture behavior and bonding mechanisms study of copper sintering on bare DBC substrate for SiC power electronics packaging

Liu, Xu; Li, Shizhen; Fan, Jiajie; Jiang, Jin; Liu, Yang; Chen, Xianping; Zhang, Guoqi

doi:10.1016/j.jmrt.2022.05.122

Cited by 26 publications

(3 citation statements)

References 57 publications

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“…As a result, a shear strength of approximately 21. [42]. In comparison with these results, the shear strength result of 18.9 MPa after 1 min bonding in air atmosphere achieved in this study implies that Cu particles well surface-treated with formic acid can provide a high sintering speed and decent sinterability by suppressing Cu oxidation.…”

Section: Shear Strength Of Bondlinessupporting

confidence: 70%

“…5 MP was obtained by bonding for 400 s at 225 °C after maintaining for 3.5 min at 100 °C[40] Son et al prepared a bimodal Cu paste by mixing 1 µm Cu particles, 0.3 µm Cu particles and polyethylene glycol-based solvent and carried out a 5 MPa compression sinter bond ing for 1 min at 280 °C between Cu dummy chips with Au finish and DBC substrates[41] With the suppression of Cu oxidation through processing in a vacuum, a high shea strength of approximately 30.5 MPa was achieved[41]. Liu et al prepared a paste by mix ing carboxylic acid-treated quasi-nanoparticles, ethylene glycol, and terpilenol and ob tained a high shear strength of 36.5 MPa after a 5 MPa compression sinter bonding for min at 250 °C in nitrogen with Cu dummy chips and DBC substrates[42]. In comparison with these results, the shear strength result of 18.9 MPa after 1 min bonding in air atmospher achieved in this study implies that Cu particles well surface-treated with formic acid can pro vide a high sintering speed and decent sinterability by suppressing Cu oxidation.…”

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confidence: 99%

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Controlling the Amount of Copper Formate Shells Surrounding Cu Flakes via Wet Method and Thermo-Compression Sinter Bonding between Cu Finishes in Air Using Flakes

Choi,

Lee

2023

Metals

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To bond a semiconductor power chip on a substrate using the formation of bondlines exhibiting long-term mechanical durability at high temperatures such as 300 °C, compression-assisted sinter bonding between Cu finishes was carried out at 300–350 °C in air. Cu flakes of approximately 7 µm were used as the main filler material; their surfaces were modified by pretreatment using a formic acid solution, and the existing oxide layers were transformed into copper formate shells. To increase the amount of the copper formate shells, the shell transformation reaction was controlled by the deliberate addition of 30 nm Cu2O particles and sustained for 50 min. The formate shells formed decomposed at a peak temperature of 250 °C, forming pure Cu, which rapidly induced sintering between the flakes and at the Cu-finish–flake interfaces. Therefore, the paste containing Cu flakes showed a sufficient shear strength of 26.3 MPa even in air after sinter bonding for only 3 min under 5 MPa at 350 °C. Although the bimodal-type paste presented near-full-density bondline structures within 3 min of adding 350 nm pure Cu particles, the strengths with respect to bonding time showed trends of values less than 26.3 MPa, owing to the excessive oxidation of the 350 nm Cu.

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Section: Shear Strength Of Bondlinessupporting

confidence: 70%

mentioning

confidence: 99%

Controlling the Amount of Copper Formate Shells Surrounding Cu Flakes via Wet Method and Thermo-Compression Sinter Bonding between Cu Finishes in Air Using Flakes

Choi,

Lee

2023

Metals

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show abstract

“…Furthermore, it leverages the nano size effects to achieve "low temperature packaging, high temperature operation" [3]. Compared to nano-Ag, nano-Cu paste has higher melting point, lower material cost, excellent thermal conductivity, and matching thermal coefficient of expansion, which is expected to become the interconnection material for the next generation of high-power electronic packaging [4][5][6].…”

Section: Introductionmentioning

confidence: 99%

Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation

Cheng

Liu

et al. 2023

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

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Nano-metal materials sintering has received increasing attention in recent years for its promising performance in the wide bandgap semiconductor packaging. In this paper, molecular dynamics (MD) simulation method were applied to simulate the nano-Cu sintering mechanism and the subsequent mechanical behavior. Hybrid sintering, comprising nanosphere (NS) and nanoflake (NF), was carried out at temperatures ranging from 500K to 650K. Furthermore, shearing simulations were conducted with constant strain rates on the sintered structure at multiple temperatures, and subsequently correlated the extracted mechanical properties with the sintering behavior. The results indicated that the mechanical properties of nano-Cu sintered structure were improved by tuning material composition and increasing the sintering temperature. We established a relationship between the sintered microstructure and mechanical response, the shear modulus and shear strength of the sintered structure with NF particles increased to 41.2GPa and 3.51GPa respectively. It offers valuable insights into the preparation phase of nano Cu paste for sintering technology.

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Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles

Cui,

Jia,

Wang

et al. 2024

J Mater Sci: Mater Electron

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Microstructural evolution, fracture behavior and bonding mechanisms study of copper sintering on bare DBC substrate for SiC power electronics packaging

Cited by 26 publications

References 57 publications

Controlling the Amount of Copper Formate Shells Surrounding Cu Flakes via Wet Method and Thermo-Compression Sinter Bonding between Cu Finishes in Air Using Flakes

Controlling the Amount of Copper Formate Shells Surrounding Cu Flakes via Wet Method and Thermo-Compression Sinter Bonding between Cu Finishes in Air Using Flakes

Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation

Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles

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