Abstract:The microstructural, creep resistance and electrical conductivity properties of Sn-0.7Cu eutectic alloy with Bi-additions in concentrations (0.3 and 0.5 wt.%) have been investigated using x-ray diffraction (XRD), Scanning electron microscope (SEM), creep testing machine and (DC) circuit respectively. The three samples were prepared from high purity (99.99%) elements Sn, Cu, and Bi using melting technique. XRD and SEM analysis showed that the eutectic Sn-0.7Cu alloy composed primarily of two phases; a body cent… Show more
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