2015
DOI: 10.1109/jmems.2015.2399696
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Micromachined Hotplate Platform for the Investigation of Ink-Jet Printed, Functionalized Metal Oxide Nanoparticles

Abstract: This paper describes a novel micromachined platform serving as an interface between nanosized, gas sensitive metal oxide particles, and the macroscopic world. Through a combination of ink-jet printing and microelectromechanical systems technologies, it thus becomes possible to quickly test and characterize new nanosized metal oxide particles with respect to their gas sensitivity. Within the framework of this report, we describe the design considerations, thermal finite-element method simulations, processing, c… Show more

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Cited by 38 publications
(27 citation statements)
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“…To detect H2S we employ copper(II) oxide (CuO) nanosphere-based functional layers [11] deposited onto micro-machined hotplates [12] via inkjet printing [13]. CuO is known to feature a highly specific reaction towards H2S even at room temperature [14], which ultimately leads to a break-down in electrical resistivity via a percolation phase transition [9,10].…”
Section: Methodsmentioning
confidence: 99%
“…To detect H2S we employ copper(II) oxide (CuO) nanosphere-based functional layers [11] deposited onto micro-machined hotplates [12] via inkjet printing [13]. CuO is known to feature a highly specific reaction towards H2S even at room temperature [14], which ultimately leads to a break-down in electrical resistivity via a percolation phase transition [9,10].…”
Section: Methodsmentioning
confidence: 99%
“…To demonstrate the possibility of depositing the a colloidal tin oxide (SnO2) ink on arbitrary substrates we use a hotplate platform that has been tailor made for testing novel functional inks [4]. The microelectromechanical system (MEMS) features a heating structure surrounding a round interdigitated electrode area of 120 µm diameter.…”
Section: Methodsmentioning
confidence: 99%
“…The microelectromechanical system (MEMS) features a heating structure surrounding a round interdigitated electrode area of 120 µm diameter. Both structures are achieved by sputtering 20 nm tantalum (Ta) and 200 nm platinum (Pt) on top of a device layer consisting of 1 µm silicon oxide (SiO2), 4 µm silicon (Si), and 400 nm p-type Boron-doped low-stress silicon nitride (SiN) [4].…”
Section: Methodsmentioning
confidence: 99%
“…The low-power consuming devices consist of a platinum heater and two interdigitated electrode structures as shown in Figure 3a, which provide an interface to read out the resistivity of the gas-sensitive metal oxide layers. Details on the fabrication and characterization of the micro-electro-mechanical system (MEMS) devices are presented in [34]. The MEMS chips are mounted in a 12-pin TO5 housing and connected to it via ball bonding.…”
Section: Methodsmentioning
confidence: 99%