Microembossing of ultrafine grained Al: microstructural analysis and finite element modelling

Qiao, Xiao Guang; Bah, Mamadou; Zhang, Jiuwen; Gao, Nong; Moktadir, Zakaria; Kraft, Michaël; Starink, M.J.

doi:10.1088/0960-1317/20/10/105002

Cited by 7 publications

(3 citation statements)

References 35 publications

(60 reference statements)

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“…However, die wear or even failure was observed, limiting the usage of silicon die. Qiao et al [14,15] investigated the Al microchannel embossing with a feather width of 10 µm. An ultrafine-grained (UFG) material was obtained by equal channel angular pressing.…”

Section: Introductionmentioning

confidence: 99%

Mass copper micro-embossing by tungsten die for MEMS applications

Liu

et al. 2018

J. Micromech. Microeng.

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The copper micro-embossing process using tungsten die was investigated in this paper, which can be applied for mass production on micro-electro-mechanical system (MEMS) components. Tungsten die fabricated by inductively coupled plasma etching was applied, because of its high mechanical strength and high accuracy. Both cold and hot micro-embossing were performed. Micro damage of both copper and tungsten was observed in cold micro-embossing, as the pressing force reached up to 10 kN. Hot micro-embossing under 473 K with a pressing force of 6 kN showed fewer micro-defects without damage. The microchannels with smaller space ratios and channel widths had better filling performances, due to their capability against friction or upsetting. The patterns were fully transferred from the tungsten die to copper workpiece with a minimum linewidth of 20 µm and aspect ratio of up to 1.09. The fabrication method shows the potential for copper MEMS component fabrication in mass production at low-cost.

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Section: Introductionmentioning

confidence: 99%

Mass copper micro-embossing by tungsten die for MEMS applications

Liu

et al. 2018

J. Micromech. Microeng.

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“…With the rapid development of microelectromechanical systems (MEMS), the demand for microstructural parts, referring to aerospace, vehicle, medical and biological devices, micro‐optics, and other fields, is unprecedented due to its advantages of small size, high precision, stable performance, high reliability, multifunction, and intellectualization . In particular, the metal with good electrical conductivity and thermal conductivity got more attention .…”

Section: Introductionmentioning

confidence: 99%

Effect of Grain Size on Formability and Deformation Mechanism of High‐Purity Aluminum during Micro‐Embossing Process at Elevated Temperature

et al. 2019

Adv Eng Mater

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Due to the high processing efficiency, the low manufacturing cost, and the emission of carbon dioxide, microforming attracts considerable attention in the field of microelectromechanical systems. Thus, the micro-embossing process is carried out for the high purity Al of coarse-grained (CG) and ultrafine-grained (UFG) microstructure at temperature ranging from 373 to 523 K. The interactive effects of grain size and temperature on formability are investigated. The results indicate that UFG pure Al is of better geometrical accuracy and surface quality in comparison with CG pure Al. Meanwhile, with the increasing temperature, the filling behavior of UFG pure Al is optimized and both CG and UFG pure Al reach full filling after embossing process at 523 K. Based on the observation of the microstructure of embossed ribs, plastic deformation together with the heat effect trigger the recrystallization of the CG pure Al and the grain growth of the UFG pure Al. The deformation mechanisms of CG and UFG pure Al are clarified, according to the evolution of misorientation angle distribution and kernel average misorientation. It is confirmed that intergranule movement for UFG pure Al includes grain boundary sliding and grain rotation accounted for the excellent formability.

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“…Micro-array channels have potential application in the fields of micro-fluidics (e.g., components for micro-reactors or micro heat exchangers) [1], micro-optics (e.g., optical grating) [2], and medical and biological devices [3]. The micro-embossing process is considered to be a very promising replication process and is widely used in manufacturing micro-channels with high aspect ratios [4].…”

Section: Introductionmentioning

confidence: 99%

Micro-Embossing Process in Ultrafine-Grained Pure Aluminum Processed by Equal-Channel Angular Pressing with Elevated Temperature

Shi

et al. 2019

KEM

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Micro-embossing tests were performed on ultrafine-grained pure Al processed by equal-channel angular pressing (ECAP) with 100 μm width of female die at different deformation temperature ranging from 298 K to 523 K under a force of 5 kN. The filling height, surface topography and microstructure of the cross section were measured by confocal scanning laser microscopy (CSLM), scanning electron microscopy (SEM) and electron backscattered diffraction (EBSD), respectively. The effects of deformation temperature on formability of ultrafine-grained (UFG) pure Al during micro-embossing were analyzed. The results show that increase in deformation temperature can improve the formability of UFG pure Al on micro-embossing. Micro hot embossing of UFG pure aluminum is characterized by the rib sidewall, surface quality, and fully transferred patterns, which shows ultrafine-grained pure Al has potential application in micro-forming.

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Microembossing of ultrafine grained Al: microstructural analysis and finite element modelling

Cited by 7 publications

References 35 publications

Mass copper micro-embossing by tungsten die for MEMS applications

Mass copper micro-embossing by tungsten die for MEMS applications

Effect of Grain Size on Formability and Deformation Mechanism of High‐Purity Aluminum during Micro‐Embossing Process at Elevated Temperature

Micro-Embossing Process in Ultrafine-Grained Pure Aluminum Processed by Equal-Channel Angular Pressing with Elevated Temperature

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