Micro thermal management of high-power diode laser bars

Lorenzen, Dirk; Bonhaus, J.; Fahrner, W.R.; Kaulfersch, E.; Wörner, E.; Koidl, P.; Unger, K.; Müller, Dietmar; Rolke, S.; Schmidt, H.E.; Grellmann, M.

doi:10.1109/41.915407

Cited by 30 publications

(3 citation statements)

References 11 publications

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“…Transactions of the ASME [46,63,64]. Such heat losses arise due to optical conversion inefficiencies during the lasing process, bulk thermal resistances, and contact resistances.…”

Section: High-powermentioning

confidence: 99%

A Review On Transient Thermal Management of Electronic Devices

Mathew

Krishnan

2021

Journal of Electronic Packaging

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Much effort in the area of electronics thermal management has focused on developing cooling solutions that cater to steady-state operation. However, electronic devices are increasingly being used in applications involving time-varying workloads. These include microprocessors (particularly those used in portable devices), power electronic devices such as IGBTs, and high-power semiconductor laser diode arrays. Transient thermal management solutions become essential to ensure the performance and reliability of such devices. In this review, emerging transient thermal management requirements are identified, and cooling solutions reported in the literature for such applications are presented with a focus on time scales of thermal response. Transient cooling techniques employing actively controlled two-phase microchannel heat sinks, phase change materials (PCM), heat pipes/vapor chambers, combined PCM-heat pipes/vapor chambers, and flash boiling systems are examined in detail. They are compared in terms of their thermal response times to ascertain their suitability for the thermal management of pulsed workloads associated with microprocessor chips, IGBTs, and high-power laser diode arrays. Thermal design guidelines for the selection of appropriate package level thermal resistance and capacitance combinations are also recommended.

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“…Transactions of the ASME [46,63,64]. Such heat losses arise due to optical conversion inefficiencies during the lasing process, bulk thermal resistances, and contact resistances.…”

Section: High-powermentioning

confidence: 99%

A Review On Transient Thermal Management of Electronic Devices

Mathew

Krishnan

2021

Journal of Electronic Packaging

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“…In particular, being able to devise physical mechanisms that would allow to increase thermal conduction is of crucial importance in the efficiency of electronic and optoelectronic devices. For example, long laser lifetimes necessitate an upper bound on the temperature of active layers thus making efficient heat removal a crucial aspect of designing laser systems [15]. In addition, heat accumulation in the depletion layer of photodetectors can lead to device failure at high optical power [16].…”

Section: Introductionmentioning

confidence: 99%

Unconventional thermal transport in thin film-on-substrate systems

Kothari

Malhotra

Maldovan

2018

J. Phys. D: Appl. Phys.

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Thin film-on-substrate are ubiquitously found architectures in nanostructured optoelectronic devices. We study thermal transport in thin films mounted over substrates and observe an unconventional behavior of thermal conductivity variation with film thickness. Specifically, we find an increased thermal conductivity with decreasing thickness which is attributed to phonon injection from substrate media. We provide an extensive investigation of the influence of interlayer thermal phonon coupling between the thin film and substrate on the thermal conductivity of the film and contrast it with bulk and isolated free-standing thin-film values. We consider Ge thin films grown over Si substrate and Al0.1Ga0.9As thin films grown over GaAs substrate. We also present a detailed spectral and structural analysis to enable rational thermal material design for optoelectronic applications.

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“…Direct liquid cooling of electronic devices or central processing units (CPUs) has been widely implemented since the heat dissipation efficiency of CPUs has reached the limit of air convective cooling [5,6]. As for the liquid cooling of high-power semiconductor lasers, the liquids are usually not in direct contact with the lasers [7,8]. To our best knowledge, direct liquid cooling from the surface of semiconductor lasers has not been reported before.…”

mentioning

confidence: 99%

Direct liquid cooling of room-temperature operated quantum cascade lasers

et al. 2006

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A compact packaging module for direct liquid cooling of roomtemperature quantum cascade lasers is implemented. The light was coupled out of the hermetically sealed package through a mid-infrared fibre epoxy-bonded to the laser. The threshold current reduces by $10%, compared to convectional substrate-side cooled lasers when using low boiling temperature (boiling point (b.p.) ¼ 34 C) 3M HFE-7000 coolant. No reduction was observed with high boiling point 3M FC-77 (b.p. ¼ 97 C) coolant.

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Micro thermal management of high-power diode laser bars

Cited by 30 publications

References 11 publications

A Review On Transient Thermal Management of Electronic Devices

A Review On Transient Thermal Management of Electronic Devices

Unconventional thermal transport in thin film-on-substrate systems

Direct liquid cooling of room-temperature operated quantum cascade lasers

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