Micro Material Processing Using UV Laser and Femtosecond Laser

Tönshoff, Hans Kurt; Ostendorf, Andreas; Körber, Klaus; Kulik, Christian; Kamlage, G.

doi:10.1007/0-306-47000-4_11

Cited by 4 publications

(2 citation statements)

References 6 publications

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“…Another reason for the good suitability for 3D structuring is the flat beam profile of the F 2 -laser. Those excimer laser allow to ablate a defined volume with low bottom roughness [RIN00,TÖN01]. Using strategies to overlap the single ablation volumes, complex microstructures can be manufactured in most relevant dielectric materials [KUL02].…”

Section: Application Driven Comparison Of Laser Beam Sourcesmentioning

confidence: 99%

Short and ultrashort laser pulses: an upcoming tool for processing optical and semiconductor materials

Kulik

2004

SPIE Proceedings

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Laser beam sources emitting pulses with durations in the regime between nano-and femtoseconds are winning more and more importance for processing optical and semiconductor materials. Beneath lithography, etching and coating, laser technology is necessary to support the production of innovative electronic and optical devices. Finest structures, cuts and drillings can be manufactured in a high variety of materials like silicon, glasses but also in composite materials like polymers.In this paper a survey on a number of laser based processes for microelectronic and optoelectronic manufacturing is presented. With regard to this context effects and material interactions are discussed and attached to different laser beam sources. The quality of processes as well as their economical meaning from perspective of laser technology is evaluated. An overview about machining and actual trends for ns-, upcoming ps-and fs-laser technology are presented.

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Section: Application Driven Comparison Of Laser Beam Sourcesmentioning

confidence: 99%

Short and ultrashort laser pulses: an upcoming tool for processing optical and semiconductor materials

Kulik

2004

SPIE Proceedings

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“…Direct photoablation of a wide range of materials is possible with excimer or ultrafast lasers. This “cold” processing yields high-quality cuts (only limited by laser spot size) but equipment costs remain prohibitive [ 16 ]. Processing with other laser systems is largely thermal (i.e., at least some of the material will undergo a solid-to-liquid transition), including the neodymium-doped yttrium aluminum garnet (Nd:YAG) lasers often used for commercial steel or nickel stencil fabrication [ 17 ].…”

Section: Introductionmentioning

confidence: 99%

Low-Cost PVD Shadow Masks with Submillimeter Resolution from Laser-Cut Paper

et al. 2020

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We characterize an affordable method of producing stencils for submillimeter physical vapor deposition (PVD) by using paper and a benchtop laser cutter. Patterning electrodes or similar features on top of organic or biological substrates is generally not possible using standard photolithography. Shadow masks, traditionally made of silicon-based membranes, circumvent the need for aggressive solvents but suffer from high costs. Here, we evaluate shadow masks fabricated by CO2 laser processing from quantitative filter papers. Such papers are stiff and dimensionally stable, resilient in handling, and cut without melting or redeposition. Using two exemplary interdigitated electrode designs, we quantify the line resolution achievable with both high-quality and standard lenses, as well as the positional accuracy across multiple length scales. Additionally, we assess the gap between such laser-cut paper masks and a substrate, and quantify feature reproduction onto polycarbonate membranes. We find that ~100 µm line widths are achievable independent of lens type and that average positional accuracy is better than ±100 µm at 4”-wafer scale. Although this falls well short of the micron-size features achievable with typical shadow masks, resolution in the tenths to tens of millimeters is entirely sufficient for applications from contact pads to electrochemical cells, allowing new functionalities on fragile materials.

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