Megasonic cleaning: A new cleaning and drying system for use in semiconductor processing

Mayer, Alexander; Shwartzman, S.

doi:10.1007/bf02651188

Cited by 37 publications

(18 citation statements)

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“…Spin drying accomplishes this and has been the most widely used technique. Hot forced-air drying is a preferred technique with less chance for particle recontamination (21,22). Capillary drying is based on capillary action and surface tension to remove the water.…”

Section: Wafer Rinsing and Dryingmentioning

confidence: 99%

The Evolution of Silicon Wafer Cleaning Technology

Kern

1990

J. Electrochem. Soc.

1,507

801

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The purity of wafer surfaces is an essential requisite for the successful fabrication of VLSI and ULSI silicon circuits. Wafer cleaning chemistry has remained essentially unchanged in the past 25 years and is based on hot alkaline and acidic hydrogen peroxide solutions, a process known as "RCA Standard Clean." This is still the primary method used in the industry. What has changed is its implementation with optimized equipment: from simple immersion to centrifugal spraying, megasonic techniques, and enclosed system processing that allow simultaneous removal of both contaminant films and particles. Improvements in wafer drying by use of isopropanol vapor or by "slow-pull" out of hot deionized water are being investigated. Several alternative cleaning methods are also being tested, including choline solutions, chemical vapor etching, and UV/ozone treatments. The evolution of silicon wafer cleaning processes and technology is traced and reviewed from the 1950s to August 1989.

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Section: Wafer Rinsing and Dryingmentioning

confidence: 99%

The Evolution of Silicon Wafer Cleaning Technology

Kern

1990

J. Electrochem. Soc.

1,507

801

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“…According to the early work achieved by B. E. Noltingk [6], all cavitation phenomena will diminish and finally disappear as the frequency is raised. As revealed by A. Mayer [7], the predominating property in a megasonic field is acoustic streaming rather than cavitation. On the other hand, a higher frequency promotes the self-guidance of acoustic streaming and enables its autofocus capability [8].…”

Section: Introductionmentioning

confidence: 98%

Design and development of megasonic system and its application to PZT nano powder dispersion

Peng

Wang

2009

International Technology and Innovation Conference 2009 (ITIC 2009)

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Although ultrasonic cavitation provides various applications for ultrasound, its inherent disadvantages can not be neglected. In ultrasonic dispersion process, ultrasound, in a frequency of 20 to 80 kHz, causes damages to materials due to excessive cavitation and inferior self-guidance. In order to alleviate cavitation and help the acoustic field focus, a novel megasonic implementing system has been designed and developed. It consists of a megasonic transducer and a Mega-Hertz power supply. The transducer is constructed in the form of cylindrical tube with a round piece of PZT-8 piezoelectric ceramic. The power supply provides sinusoidal voltage and current outputs at oscillating frequency ranging from 630 kHz to 650 kHz. The transducer consumes an electrical power of over 400W. The acoustic pressure is measured within the range of 2.86 MPa to 8.92 MPa by a PVDF sensor. Experimental results of Megasonic dispersion of PZT nano powder manifest the conglomeration prevention effect, which is characterized by Thermal Field Emission SEM (TFE-SEM), Transmission Electron Microscopy (TEM), and the stable constitution of PZT nano particle through treatment, which is confirmed by X-Ray Diffraction (XRD).

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“…These processes can be accelerated by means of ultrasonic agitation. Ultrasound with frequencies near 1 MHz, known as megasound, has been employed for cleaning in microtechnology since 1979 [4]. Since megasound provides high quality with respect to quantitative and at the same time gentle cleaning of deep microstructures it is a well-established technology.…”

Section: Introductionmentioning

confidence: 99%