2003
DOI: 10.1023/a:1024944316369
|View full text |Cite
|
Sign up to set email alerts
|

Mechanical properties and fracture toughness of organo-silicate glass (OSG) low-k dielectric thin films for microelectronic applications

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

3
44
1

Year Published

2006
2006
2019
2019

Publication Types

Select...
4
3
2

Relationship

0
9

Authors

Journals

citations
Cited by 78 publications
(48 citation statements)
references
References 32 publications
3
44
1
Order By: Relevance
“…The curvature was measured along two orthogonal directions over the central area. Then, the average stress was calculated from a modified version of Stoney's equation 19,20 using elastic modulus E = 73 ± 1 GPa and Poisson's ratio ν = 0.23 for the glass substrate. 21 The samples were deformed by a Berkovich diamond pyramid using a NanoHardness Tester machine from CSEM (Switzerland).…”
Section: Mechanical Characterizationmentioning
confidence: 99%
“…The curvature was measured along two orthogonal directions over the central area. Then, the average stress was calculated from a modified version of Stoney's equation 19,20 using elastic modulus E = 73 ± 1 GPa and Poisson's ratio ν = 0.23 for the glass substrate. 21 The samples were deformed by a Berkovich diamond pyramid using a NanoHardness Tester machine from CSEM (Switzerland).…”
Section: Mechanical Characterizationmentioning
confidence: 99%
“…Other popular quantitative adhesion tests are the four-point bend [7], and the superlayer indentation tests [8]. In addition to measuring interfacial fracture toughness, indentation methods are also capable of assessing thin film and coating toughness [9,10].…”
Section: T E S C C C Thermalmentioning
confidence: 99%
“…Gerberich et al (2002) studied fracture defects on single crystal W(100) by means of the length scale surface to volume approach. Single phase and rather smooth organo-silicate glass low-K materials were investigated by Vella et al (2003) where a qualitative fracture toughness evaluation method based on critical strain/stress energy release rate was explored and illustrated by the AFM/SPM and SEM cross section images of fractured interfaces. A few nanometer thick organic smooth low-K films deposited on a silicon substrate were investigated by Nay et al (2004) using the nanoindentation technique at low sub mN loads.…”
Section: Introductionmentioning
confidence: 99%