Measurements of plastic localization by heaviside-digital image correlation

Bourdin, François; Stinville, J.C.; Echlin, McLean P.; Callahan, Patrick G.; Lenthe, William C.; Torbet, Chris; Texier, Damien; Bridier, Florent; Cormier, Jonathan; Villechaise, Patrick; Pollock, Tresa M.; Valle, Valéry

doi:10.1016/j.actamat.2018.07.013

Cited by 97 publications

(69 citation statements)

References 48 publications

(47 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This qualitative slip characterization is incapable of quantifying the displacement amplitude associated with individual slip bands nor the in-plane/ out-of-plane gliding direction. While complementary ex-situ atomic force microscopy (AFM) observations aim to quantitatively investigate the out-of-plane intensity of the slip band emergence and/or extrusions [8,14], the timeliness of this nanoscale characterization technique is not suitable for the investigation of nearlymillimeter-squared regions of interest, required for the statistical study of crystal plasticity in tens-of-micrometer grain size materials [3]. Therefore, alternative solutions are needed for the quantitative and statistical assessment of slip localization, i.e.…”

Section: In-plane and Out-of-plane Deformation At The Sub-grain Scalementioning

confidence: 99%

“…Signal-to-noise ratio, artifacts in image acquisition and spatial resolution were critical limitations [21]. Ongoing improvements of image acquisition techniques and speckle patterning now make it possible to assess in-plane discrete deformation via individual slip bands [4e6, 14,22,23]. HR-SEM-DIC also demonstrated the capability to assess reversible elastic but intense deformations of a polycrystalline nickel-based superalloy due to the anisotropic stiffness of individual grains in relation to the macroscopic loading [5].…”

Section: In-plane and Out-of-plane Deformation At The Sub-grain Scalementioning

confidence: 99%

“…Such slip system identification and evaluation of local deformation is not possible using solely conventional in-plane DIC methods due to the continuum mechanics approach affecting the displacement values in the vicinity of the discontinuity. To remedy issues associated with slip-band induced localization, discontinuity-tolerant Heaviside-DIC and relative displacement ratio methods were recently developed to in-situ identify active slip systems using solely in-plane information and indirect calculation of the out-of-plane response [14,24]. These methods allow an accurate assessment of the in-plane sliding and shearing displacements in the vicinity of a slip band, but is not capable of providing in-situ out-of-plane displacements.…”

Section: In-plane and Out-of-plane Deformation At The Sub-grain Scalementioning

confidence: 99%

“…Similar diffuse kinematical fields were obtained with conventional SEM-DIC means [18e20], despite a much higher spatial resolution. The assessment of such discrete crystal plastic deformations was hitherto possible only via high resolutionscanning electron microscopy-digital image correlation (HR-SEM-DIC) technique due to mostly a higher spatial resolution and distortion corrections [4e6, 14,22,23]. The HR-LSCM-DIC technique is thus particularly interesting for investigating slip activity due to the additional out-of-plane information and its speed/resolution ratio.…”

Section: Technical Considerations For the Hr-lscm-dic Techniquementioning

confidence: 99%

“…Such slip system identification is not possible using solely conventional in-plane DIC methods at the sub-grain level due to the continuum mechanics approach affecting the displacement values in the vicinity of the discontinuity. In order to better remedy such issues with discrete slip systems, a discontinuity-tolerant Heaviside-DIC method has recently been developed in order to in-situ evaluate active slip system via in-plane HR-SEM-DIC, making that the assumption the out-of-plane response necessarily follows the accumulated Burgers vector for one active slip system per slip band [14]. Applying the discontinuity-tolerant Heaviside-DIC method to LSCM data would be worth investigation to dismiss all assumptions on the out-ofplane deformation.…”

Section: In-plane and Out-of-plane Kinematical Measurements For Slipmentioning

confidence: 99%

See 4 more Smart Citations

In-plane and out-of-plane deformation at the sub-grain scale in polycrystalline materials assessed by confocal microscopy

et al. 2019

Self Cite

View full text Add to dashboard Cite

a b s t r a c tHigh-resolution digital image correlation (HR-DIC) techniques have become essential in material mechanics to assess strain measurements at the scale of the elementary mechanisms responsible of the deformation in polycrystalline materials. The purpose of this study is to demonstrate the use of laser scanning confocal microscopy (LSCM) coupled with DIC techniques to deepen knowledge on the deformation process of a polycrystalline nickel-based superalloy at room temperature. The LSCM technique is capable of detecting both in-plane and out-of-plane strain localization within slip bands at the sub-grain level. The LSCM observations are consistent with previous in-situ scanning electron microscopy (SEM) studies: The onset of crystal plasticity occurs primarily near S3 twin boundaries with macroscopic loading in the elastic domain (macroscopic stress as low as 80% of the 0.2% offset yield strength (Y.S. 0.2% )). This intense irreversible strain localization occurs with either a high Schmid factor (m > 0.43) or a significant elastic modulus difference between the pair of twins (DЕ > 100 GPa). In the plastic deformation domain, transgranular slip activity following slip systems with the highest Schmid factor is mostly responsible for the deformation at the grain level, thus leading to strain percolation. The simultaneous in-plane and out-of-plane deformation assessment via the HR-LSCM-DIC technique was found to be essential for the identification of active slip systems. Finally, the HR-LSCM-DIC technique enabled the quantification of the glide amplitude involved in the three-dimensional shearing process at the grain level that solely in-plane measurements cannot provide.

show abstract

Section: In-plane and Out-of-plane Deformation At The Sub-grain Scalementioning

confidence: 99%

Section: In-plane and Out-of-plane Deformation At The Sub-grain Scalementioning

confidence: 99%

Section: In-plane and Out-of-plane Deformation At The Sub-grain Scalementioning

confidence: 99%

Section: Technical Considerations For the Hr-lscm-dic Techniquementioning

confidence: 99%

Section: In-plane and Out-of-plane Kinematical Measurements For Slipmentioning

confidence: 99%

See 3 more Smart Citations

In-plane and out-of-plane deformation at the sub-grain scale in polycrystalline materials assessed by confocal microscopy

et al. 2019

Self Cite

View full text Add to dashboard Cite

show abstract

Review on Strain Localization Phenomena Studied by High‐Resolution Digital Image Correlation

Weidner

Biermann

2021

Adv Eng Mater

View full text Add to dashboard Cite

She studied Materials Science in Freiberg and received her doctorate and habilitation. Her primary research interests focus on plasticity, fatigue, and related microstructural analysis of materials. Her particular interests are related to the application of complementary in situ characterization techniques for better understanding of kinetics of deformation and damage processes. To date she has authored or coauthored over 100 peer-reviewed publications.

show abstract

Colorimetric Detection of Mechanical Deformation in Metals using Thin‐Film Mechanochromic Sensor

Bae

Seo

Lee

et al. 2021

Adv Materials Technologies

View full text Add to dashboard Cite

tively captured during deformation using one or more cameras, and the obtained digital image data (a series of photos) are analyzed using the DIC software. The displacements and strains of individual regions are determined by correlating the position of pixel subsets in the images, typically based on contrast (i.e., gray intensity levels). Combined with scanning electron microscopy (SEM), DIC can also be used to monitor microstructural changes in metals during deformation. [7][8][9] For DIC to work effectively, the surface of the specimen must have a random pattern. It is generally obtained by spraying black and white paint onto the specimen surface. Although DIC is an effective technique for generating full-field strain maps, its use in outdoor environments is challenging because a permanent setup is required for multiple measurements at different stages of deformation. There is a need for measurement techniques that can be easily implemented, and are highly accurate.In this study, we present a colorimetric method for measuring mechanical deformation in metals. This method is based on the color change in an attached thin-film mechanochromic sensor. The goal of this study is to develop a cost-effective and feasible technique for structural health monitoring. If mechanochromic sensors are attached to the surfaces of a metallic engineering structure, as shown in Figure 1a, the damage to the structure can be identified by the color changes in the sensor. This approach significantly helps prevent disasters by forecasting the potential failure of a structure. Sensors invisible to the naked eye may be captured using a camera with a telescopic lens. Difficult-to-access areas can be monitored using drones. Despite numerous, recent studies on mechanochromic sensors and their applications, [10][11][12][13][14][15][16][17][18][19][20][21][22][23][24][25][26][27][28][29] the quantitative measurement of mechanical deformation in metals through the use of mechanochromic sensors has not yet been reported. Many mechanochromic sensors developed to date employ periodic structures such as photonic crystals and surface relief patterns. [14][15][16][26][27][28] Although these periodic structures exhibit high wavelength selectivity, the iridescent nature of the revealed color and the difficulty in maintaining periodicity over a large area limit the practical application of these structures. Photonic glasses with a short-range order may exhibit angle-independent colors; [30][31][32] however, their reflection spectra are extremely broad with low reflectivity, thereby leading to weak and dark colors. In this study, a Fabry-Perot (F-P) resonator structure comprising

show abstract

Measurements of plastic localization by heaviside-digital image correlation

Cited by 97 publications

References 48 publications

In-plane and out-of-plane deformation at the sub-grain scale in polycrystalline materials assessed by confocal microscopy

In-plane and out-of-plane deformation at the sub-grain scale in polycrystalline materials assessed by confocal microscopy

Review on Strain Localization Phenomena Studied by High‐Resolution Digital Image Correlation

Colorimetric Detection of Mechanical Deformation in Metals using Thin‐Film Mechanochromic Sensor

Contact Info

Product

Resources

About