2015
DOI: 10.1016/j.mee.2015.06.008
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Measurement of out-of-plane thermal conductivity of substrates for flexible electronics and displays

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Cited by 13 publications
(6 citation statements)
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“…The inlaid insulation however leads to a parasitic heat flow bypassing the thermoelectric material and an overall reduction of the power conversion efficiency. For the devices fabricated in this work a quick estimation with the dimension given in the layout, the thermal conductivities from Table 1, and the thermal conductivity of PEN 34 of 0.22 Wm −1 K −1 yields that the thermal resistance of the origami TEGs is 24.53% lower than if the TE elements were separated by 6 μm of air 35 with the thermal conductivity of 0.0264 Wm −1 K −1 . This effect is thereby rather significant.…”
Section: Fabrication Of Origami Folded Devicesmentioning
confidence: 99%
“…The inlaid insulation however leads to a parasitic heat flow bypassing the thermoelectric material and an overall reduction of the power conversion efficiency. For the devices fabricated in this work a quick estimation with the dimension given in the layout, the thermal conductivities from Table 1, and the thermal conductivity of PEN 34 of 0.22 Wm −1 K −1 yields that the thermal resistance of the origami TEGs is 24.53% lower than if the TE elements were separated by 6 μm of air 35 with the thermal conductivity of 0.0264 Wm −1 K −1 . This effect is thereby rather significant.…”
Section: Fabrication Of Origami Folded Devicesmentioning
confidence: 99%
“…However, these very thin and flexible substrates tend to have thermal conductivity issues when they are used for applications with high power dissipating profiles. The low thickness and low thermal conductivity of these substrate materials can cause poor heat spreading performance while, factors such as excessive thermal expansion and low glass transition temperature can change the physical and chemical properties of the substrate materials under the heat [ 13 ].…”
Section: Printing Electronics For a Lower Environmental Impactmentioning
confidence: 99%
“…Total thermal resistance across a material stack is determined by sandwiching the stack between two identical copper blocks [28]. Fig.…”
Section: Thermal Measurementsmentioning
confidence: 99%