Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review

Li, Mulan; Zhang, Liang; Jiang, Nan; Zhang, Lei; Zhong, Shengwen

doi:10.1016/j.matdes.2020.109224

Cited by 73 publications

(22 citation statements)

References 96 publications

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“…Currently, Sn-based solders have the most potential to replace SnPb solders. 4) Solders that are suitable for lowtemperature applications are SnBi, 5) SnAg, 6) SnAgCu, 7,8) and SnZn. 9) SnSb 10) and AuSn 11) are suitable for hightemperature applications.…”

Section: Introductionmentioning

confidence: 99%

Structure and Properties of Au–Sn Lead-Free Solders in Electronic Packaging

Wang

Zhang

2022

Mater. Trans.

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The requirements for electronic devices in high-temperature environment such as avionics and automotive have promoted the development of high-temperature solders. The Au20Sn solder, which is one of the hot topics of the current research in the field of electronic packaging, is widely used in flip-chip, light-emitting diode and hermetic package fields because of its good creep resistance, corrosion resistance and flux-free soldering. Recent research about the microstructure, wettability, interfacial intermetallic compounds, and mechanical properties of Au20Sn solder were reviewed. This paper focuses on the interfacial reaction of Au20Sn with different substrates and the mechanical properties of Au20Sn solder joints. In addition, the current research shortages of Au20Sn solders and the development directions are presented.

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Section: Introductionmentioning

confidence: 99%

Structure and Properties of Au–Sn Lead-Free Solders in Electronic Packaging

Wang

Zhang

2022

Mater. Trans.

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“…Despite significant advances in the electronic component industry, this problem remains on the agenda and is still an area of interest from the researcher's point of view (Engelmaier, 1989). To mitigate this CTE mismatch, which leads to failures, different research approaches have been taken (Li, 2021;Xiao, 2014). Most of the research has assessed the inclusion of nano/ micro particles of different materials directly in the solder.…”

Section: Introductionmentioning

confidence: 99%

Effect of the IMC layer geometry on a solder joint thermomechanical behavior

Capela

Souza

Costa

et al. 2022

SSMT

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Purpose In a printed circuit board assembly (PCBA), the coefficient of thermal expansion (CTE) mismatch between the solder joint materials has a detrimental impact on reliability. The mechanical stresses caused by the thermal changes of the assembly lead to fatigue and sometimes the failure of the solder joints. The purpose of this study is to propose a novel pad design to obtain an interrupted solder/substrate interface, to improve the PCBA reliability. Design/methodology/approach An interruption in the continuous intermetallic compound (IMC) layer of a solder joint was implemented, by the deposition of a silicone film in the pad, changing its geometry. That change allows a redistribution of stresses in the most ductile zone of the solder joint, the solder. The stress concentration at the solder/substrate interface is reduced, as well as the general state of stress at the solder joint. Findings A new way was developed to reduce the stress on the solder joints, caused by thermal variations, because of the different components CTEs mismatch. This new method consists of interrupting the IMC layers of the solder joint, strategically, redirecting the usual stresses to a more ductile area of the joint, the solder. This is an innovative method that allows increase the lifetime of PCBAs and the equipments. Originality/value In this study, a new pad design concept for higher solder joint reliability was developed to reduce the shear stress in the solder joints because of the CTE mismatch between all the solder joint components.

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“…Nanocomposite solders were discovered to have melting temperatures similar to SAC solders which exhibits the excessive growth of IMC. The aim of incorporating nanoparticles into lead-free solders is to reinforce the solder through particle dispersion, that improves solder deformation resistance by preventing dislocation movement and constraining grain boundaries in the solder matrix [11,12].…”

Section: Introductionmentioning

confidence: 99%

Effects of TiO₂ and Al₂O₃ nanoparticles addition on the thermal properties and wettability of Sn-3.0Ag-0.5Cu-xTiO₂-xAl₂O₃

Muzni

Noor

Abdullah

et al. 2022

J. Phys.: Conf. Ser.

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This study investigated the effects of adding titanium dioxide (TiO2) and aluminium oxide (Al2O3) nanoparticles into Sn3.0Ag0.5Cu (SAC) lead-free solder alloy on the thermal properties and wettability. In comparison with SAC lead-free solder without addition of nanoparticles, the melting temperature is very similar and comparable. The solidus temperature is in the range of 217.1 to 217.2 °C with the addition of TiO2 and Al2O3 nanoparticles. The results shows that the addition of 0.25-1.0 wt% of TiO2 and Al2O3 nanoparticles caused the liquidus temperature to decrease from 222.4 to 220.5 °C. The spreading area of SAC-xTiO2-xAl2O3 lead-free solder increases from 5.7 to 7.1mm at 0-0.5wt% of TiO2 and Al2O3 nanoparticles. The contact angle decreased from 66.09° to 46.84° when the composition of TiO2 and Al2O3 increases from 0-0.5wt%.

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Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review

Cited by 73 publications

References 96 publications

Structure and Properties of Au–Sn Lead-Free Solders in Electronic Packaging

Structure and Properties of Au–Sn Lead-Free Solders in Electronic Packaging

Effect of the IMC layer geometry on a solder joint thermomechanical behavior

Effects of TiO₂ and Al₂O₃ nanoparticles addition on the thermal properties and wettability of Sn-3.0Ag-0.5Cu-xTiO₂-xAl₂O₃

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Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review

Cited by 73 publications

References 96 publications

Structure and Properties of Au–Sn Lead-Free Solders in Electronic Packaging

Structure and Properties of Au–Sn Lead-Free Solders in Electronic Packaging

Effect of the IMC layer geometry on a solder joint thermomechanical behavior

Effects of TiO2 and Al2O3 nanoparticles addition on the thermal properties and wettability of Sn-3.0Ag-0.5Cu-xTiO2-xAl2O3

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Product

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Effects of TiO₂ and Al₂O₃ nanoparticles addition on the thermal properties and wettability of Sn-3.0Ag-0.5Cu-xTiO₂-xAl₂O₃