KEM 2009 DOI: 10.4028/www.scientific.net/kem.407-408.460 View full text
Abstract: The material removal mechanisms of sapphire substrate in double-side lapping process were studied. The concepts of brittle vs. ductile machining and two-body vs. three-body abrasion were used to classify the processing mechanisms. The material removal models of double-side lapping process in different mechanisms were analyzed and researched. The experiment showed that the material removal model can describe double-side lapping process of sapphire qualitatively.
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