2011
DOI: 10.1149/2.008202esl
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Low-Temperature Atomic Layer Deposition of Cobalt Oxide Thin Films Using Dicobalt Hexacarbonyl tert-Butylacetylene and Ozone

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Cited by 32 publications
(23 citation statements)
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“…The growth rate was saturated for CpCo(CO) 2 exposures over 3 Â 10 5 L (Langmuir, 1 L ¼ 10 À6 TorrÁs) for a fixed O 3 /O 2 exposure of 5 Â 10 8 L, as shown in Fig. 12 Figure 2 indicates the growth rates of the deposited films at different temperatures based on TEM observations. It also was nearly saturated with O 3 /O 2 exposures over 1 Â 10 9 L for a fixed CpCo(CO) 2 exposures of 5 Â 10 6 L, as shown in Fig.…”
Section: Resultsmentioning
confidence: 93%
See 1 more Smart Citation
“…The growth rate was saturated for CpCo(CO) 2 exposures over 3 Â 10 5 L (Langmuir, 1 L ¼ 10 À6 TorrÁs) for a fixed O 3 /O 2 exposure of 5 Â 10 8 L, as shown in Fig. 12 Figure 2 indicates the growth rates of the deposited films at different temperatures based on TEM observations. It also was nearly saturated with O 3 /O 2 exposures over 1 Â 10 9 L for a fixed CpCo(CO) 2 exposures of 5 Â 10 6 L, as shown in Fig.…”
Section: Resultsmentioning
confidence: 93%
“…Cobalt oxide films were prepared by ALD using Co(thd) 2 and ozone (O 3 ) at 114-307 C, and the growth rate was 0.02 nm/cycle. 12 Cobalt oxide films were grown in atomic layer deposition mode at 68 C with a growth rate of 0.08 nm/cycle and showed excellent step coverage. In the previous work, we used CCTBA and ozone to deposit cobalt oxide films.…”
Section: Introductionmentioning
confidence: 99%
“…20 A majority of the reported ALD cobalt oxide processes rely on the use of either oxygen plasma or ozone to remove the ligands of the metalorganic or organometallic cobalt precursors. [21][22][23][24][25][26][27][28][29] Due to the high oxidative power of O2 plasma and O3, the ligand combustion approach leads to oxidation of cobalt to Co 3+ and the subsequent formation of Co3O4 films. In order to deposit CoO films, the use of highly oxidizing co-reactants should therefore be avoided.…”
Section: Introductionmentioning
confidence: 99%
“…Atomic layer deposition and CVD processes utilizing CCTBA have been reported for depositing cobalt metal (as a copper diffusion barrier, a seed layer, and for subsequent silicidation) 5864 and cobalt oxide films. 65 Although CCTBA is a liquid, it exhibits a relatively low vapor pressure at room temperature and the tendency is to deliver CCTBA at elevated temperatures to increase partial pressure. 60,63,65 However, there is a potential for CCTBA to decompose if it is maintained at elevated temperatures for prolonged periods.…”
Section: Introductionmentioning
confidence: 99%
“…65 Although CCTBA is a liquid, it exhibits a relatively low vapor pressure at room temperature and the tendency is to deliver CCTBA at elevated temperatures to increase partial pressure. 60,63,65 However, there is a potential for CCTBA to decompose if it is maintained at elevated temperatures for prolonged periods. Decomposition can result in the evolution of CO, as well as other compounds.…”
Section: Introductionmentioning
confidence: 99%