2005
DOI: 10.1109/jssc.2005.848144
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Low-power voltage-controlled oscillators in 90-nm CMOS using high-quality thin-film postprocessed inductors

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Cited by 24 publications
(4 citation statements)
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“…The fact that our VCO achieves the best PN (both for simulated and measured) and a very high FOM [23] should be noted. In detail, the achieved FOM at the central frequency is equal to 189.5 dBc/Hz at 100 kHz and 194.1 dBc/Hz at 1 MHz, which are the best results if compared with the previous works both for active [24,25] and passive inductors (both for simulated and measured) and very close to those obtained in the case of VCO based on high-Q passive inductors realized with additional steps in the fabrication process [4]. The layout of the test-chip is reported in Figure 14.…”
Section: Vco Design For 5-6 Ghz Wlanssupporting
confidence: 76%
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“…The fact that our VCO achieves the best PN (both for simulated and measured) and a very high FOM [23] should be noted. In detail, the achieved FOM at the central frequency is equal to 189.5 dBc/Hz at 100 kHz and 194.1 dBc/Hz at 1 MHz, which are the best results if compared with the previous works both for active [24,25] and passive inductors (both for simulated and measured) and very close to those obtained in the case of VCO based on high-Q passive inductors realized with additional steps in the fabrication process [4]. The layout of the test-chip is reported in Figure 14.…”
Section: Vco Design For 5-6 Ghz Wlanssupporting
confidence: 76%
“…Examples of high-Q passive inductors have been presented in literature [4]. These inductors are realized by means of additional steps in the fabrication process, which cause a dramatic increase of the chip fabrication costs.…”
Section: Introductionmentioning
confidence: 99%
“…On the other hand, ferromagnetic alloy film must be isolated from the coils due to its low resistivity, which limits its magnetic flux enhancing effect. Other methods to improve the inductors' performance are also discussed in [26][27][28][29][30][31]. But most of these magnetic materials have their limitations.…”
Section: Introductionmentioning
confidence: 99%
“…Other technologies more compatible with IC fabrication that enable high Q inductors have been reported. High quality wafer-level packaging ͑WLP͒ inductors [16][17][18] offers novel opportunities for the realization of high-quality on-chip inductors needed in rf front ends. For WLP inductors, a thin low-k dielectric layer ͑benzocy-clobutene͒ reduces substrate losses and the parasitic capacitance to the patterned ground shield.…”
Section: Introductionmentioning
confidence: 99%