2022
DOI: 10.1016/j.actamat.2022.118066
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Low contact resistivity and excellent thermal stability of p‐type YbMg0.8Zn1.2Sb2/Fe‐Sb junction for thermoelectric applications

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Cited by 14 publications
(6 citation statements)
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“…The presence of the reaction is beneficial for strong interfacial bonding [ 34 ]. Considering the similar composition of the reaction layer in both n- and p-type junctions, the greater thickness in the latter is due to the weaker bonding of the Zn–Sb bonds leading to more Sb being involved in the reaction during sintering [ 35 ]. As shown in Fig.…”
Section: Resultsmentioning
confidence: 99%
“…The presence of the reaction is beneficial for strong interfacial bonding [ 34 ]. Considering the similar composition of the reaction layer in both n- and p-type junctions, the greater thickness in the latter is due to the weaker bonding of the Zn–Sb bonds leading to more Sb being involved in the reaction during sintering [ 35 ]. As shown in Fig.…”
Section: Resultsmentioning
confidence: 99%
“…[36,45] This deteriorates the carrier concentration and mobility and consequently impacts the TE properties. [18,37] Regarding the reduced saturated vapor pressure of protective coating, the spontaneous process of the Mg evaporation could be understood by the relationship, i.e., ln G nRT P P e ∆ = . As the surrounding pressure (P) is less than the saturated vapor pressure (P e ), i.e., ΔG < 0, the volatilization can proceed spontaneously.…”
Section: Suppression Of Mg Evaporation Of Mg 3 Sb 15 Bi 05 By the Mg-...mentioning
confidence: 99%
“…Thus, it is difficult to balance the high σ s and low ρ c values of a single-element TEiM. Some alloying TEiM layers for n-type Mg 3 Sb 1-x Bi x TEcM legs, including 304 stainless steel (304SS), [36] Mg 2 Cu, [10] Fe 90 Sb 10 , [37] and Mg 3.4 Sb 3 Ni [38] were subsequently reported to show lower ρ c values. Very recently, Song et al reported that the NiFe/Mg 3 Bi 1.5 Sb 0.5 contact exhibits a highly stable ρ c of 13 µΩ cm 2 after aging for over 2100 h. [39] The authors have suggested an alloying approach to design the TEiM rather than using available alloys, which has already been verified as an effective technique route with some necessary characteristics, including high bonding propensity, coefficient of thermal expansion (CTE) matching, diffusion passivation, and dopant inactivation.…”
Section: Introductionmentioning
confidence: 99%
“…[55,56] Therefore, the performance of the module would be further improved if the contact resistance could be lowered by using the newly developed contact materials for Mg 3 Sb 2 -based compounds. [26,32,57,58] To verify the reliability of the measured conversion efficiency, an uncertainty analysis of heat flow measurement was conducted. As shown in Figure S9a (Supporting Information), the temperature drops in the tin bar (ΔT tin ) increase linearly with increasing T h .…”
Section: Conversion Efficiency Of the Mgmentioning
confidence: 99%