The realization of VLSl will be limited by the lithographic capability available for pattern definition. By 1982 it is expected that semiconductor manufacturing will require pattern resolution in the order of lym, with an overlay tolerance of approximately 0.25ym over a 125mm wafer. Clearly, this represents a significant challenge for developers of lithographic techniques and systems. Several approaches are being investigated t o meet this challenge, including deep UV optical radiation, electron beams, and so…
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