2013 26th International Conference on VLSI Design and 2013 12th International Conference on Embedded Systems 2013
DOI: 10.1109/vlsid.2013.192
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Abstract: Abstract-Relentless CMOS technology scaling has resulted in increased on-chip temperature leading to serious concerns about lifetime reliability of micro-processors. Though dynamic thermal management techniques can control peak temperature, they often fail to meet the reliability targets due to the complex interplay between temperature and reliability. In this paper, we propose a dynamic reliability management (DRM) technique that exploits architectural adaptation in conjunction with dynamic voltage/frequency … Show more

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