Amorphous silicon (a-Si) films were crystallized using three grain growth modes induced by micro-thermal-plasma-jet (µ-TPJ) irradiation and applied to the channel regions of thin-film transistors (TFTs). Solid phase crystallization (SPC) formed microcrystalline grains and showed a lower crystallinity of 70%, whereas leading wave crystallization (LWC) and high-speed lateral crystallization (HSLC) formed significantly larger grains than the TFT channel region. The SPC-TFT showed a lower field-effect mobility (μFE) due to the small grain size and the existence of many grain boundaries, whereas LWC- and HSLC-TFT channels were formed by only single grains and showed a μFE higher than 300 cm2 V−1 s−1 in the n-channel. The defect density of HSLC was smaller than that of LWC; consequently, the HSLC-TFT performed better than the LWC-TFT. The maximum μFE values of n- and p-channel HSLC-TFTs were 418 and 224 cm2 V−1 s−1, respectively.