Leaching behavior of copper using electro-generated chlorine in hydrochloric acid solution

Kim, Eun Young; Kim, Min-seuk; Lee, Jae-chun; Yoo, Kyoungkeun; Jeong, Jaeseung

doi:10.1016/j.hydromet.2009.10.009

Cited by 69 publications

(26 citation statements)

References 21 publications

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“…(e-waste) 등으로부터 gold 용출에 활용되고 있다 (Kozin et al, 2002;Kim et al, 2010;Yang et al, 2011). 특히 폐 전자부품에는 많은 양의 gold와 silver 가 포함되어 있고 또한 방대한 양의 폐 전자부품이 발 생되고 있어, 폐 전자부품이 gold를 공급하는 도시광산 (urban mine)으로 작용하고 있다 (Cui and Zhang, 2008 (Puvvada and Tran, 1995;Navarro et al, 2004;Gamboa et al, 2005aGamboa et al, , 2005b.…”

Section: 서 론unclassified

Leaching of Silver (Ag) from Electronic Scrap by Thiourea

So¹,

Lee²,

Cho³

et al. 2018

Korean J. Met. Mater.

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In order to apply the silver cementation method using Fe powder from pregnant thiourea leaching solution. Parameters such as the amount of Fe powder addition, agitation speed, and temperature were investigated. The silver cementation rate was increased by the increasing of Fe powder addition, agitation speed, and temperature. The highest silver cementation rate was found when the addition of Fe powder was 50 g/L at the agitation speed of 500 rpm. The silver cementation rate increase with increasing temperature according to the Arrhenius equation and obeys 1 st order kinetics. The activation energy from the kinetics data was found to be between 13.73 KJ/mol and 17.02 KJ/mol. In the XRD analysis, goethite was detected in the precipitate of the thiourea leach solution. This indicates that an oxidation-reduction reaction had occurred in the thiourea solution due to the addition of the Fe powder.

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Section: 서 론unclassified

Leaching of Silver (Ag) from Electronic Scrap by Thiourea

So¹,

Lee²,

Cho³

et al. 2018

Korean J. Met. Mater.

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“…Copper plays an important role in our daily life and is widely used in industry 1,2) . When exposed to air for a long time, copper products ultimately get oxidized and corroded as dust and moisture adhere to them.…”

Section: Introductionmentioning

confidence: 99%

Preparation of a Cu Surface with the Hierarchical Structure of a Lotus Leaf via Electroplating and Its Superhydrophobicity

et al. 2017

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A lotus leaf exhibits excellent superhydrophobic properties because of its hierarchical microstructure and a waxy hydrophobic material covering its surface. Herein, the lotus leaf was used as a template and a copper surface layer with a microstructure similar to the lotus leaf was prepared by electroplating. Experimental results show that the plating samples saved micron-sized structure of the lotus leaf, such as papillae. At the same time, owing to the speci city of the electroplating method, smaller grains were formed as the second-level structure on the papillae, forming a hierarchical structure that makes it possible to obtain a superhydrophobic surface. The plated copper surface exhibited excellent hydrophobic properties with a contact angle of 160 , which is higher than that of the lotus leaf (157 ) and also much higher than that of smooth copper covered with an identical uroalkyl silane (112 ). This affords a novel idea for preparing of superhydrophobic surfaces.

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“…The application of such technique has been employed in processing of metallic materials containing Fe, Cu, Ni, Co, W, Al, etc. [15][16][17][18][19]. The above reported studies were performed by taking either metal alone or its alloy using different acid/alkali solution.…”

Section: Introductionmentioning

confidence: 99%