Laser shaping of photonic materials: deep-ultraviolet and ultrafast lasers

Herman, Peter R.; Marjoribanks, R. S.; Oettl, A.; Chen, K; Konovalov, I. A.; Ness, S.

doi:10.1016/s0169-4332(99)00463-8

Cited by 166 publications

(81 citation statements)

References 31 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…For instance, photoresists respond to light by breaking or reforming bonds, leading to pattern formation in the material. Alternatively, LDW can cause defects in photoetchable glass ceramics 20 or other optical materials through single-and multiphoton mechanisms, 21 enabling novel applications in optical storage, 22 photonic devices, 23,24 and microfluidics.…”

Section: Laser Direct-write Modification (Ldwm)mentioning

confidence: 99%

Laser Direct-Write Processing

Arnold¹,

Piqué²

2007

MRS Bull.

View full text Add to dashboard Cite

Direct-write techniques enable computer-controlled two-and three-dimensional pattern formation in a serial fashion. Among these techniques, the versatility offered by laser-based direct-write methods is unique, given their ability to add, remove, and modify different types of materials without physical contact between a tool or nozzle and the material of interest. Laser pulses used to generate the patterns can be manipulated to control the composition, structure, and even properties of individual three-dimensional volumes of materials across length scales spanning six orders of magnitude, from nanometers to millimeters. Such resolution, combined with the ability to process complex or delicate material systems, enables laser direct-write tools to fabricate structures that are not possible to generate using other serial or parallel fabrication techniques. The goal of the articles in this issue of MRS Bulletin is to illustrate the range of materials processing capabilities, fundamental research opportunities, and commercially viable applications that can be achieved using recently developed laser direct-write techniques. We hope that the articles provide the reader with a fresh perspective on the challenges and opportunities that these powerful techniques offer for the fabrication of novel devices and structures.

show abstract

Section: Laser Direct-write Modification (Ldwm)mentioning

confidence: 99%

Laser Direct-Write Processing

Arnold¹,

Piqué²

2007

MRS Bull.

View full text Add to dashboard Cite

show abstract

“…Basic setup of LBM development and fabrication. However, these properties make the glass a challenging material to machine (Herman, 2000). Due to poor thermal properties, fabrication of finely machined features using laser-based processes e.g.…”

Section: Development Of a Measure Tool That Through Cbr Handles Thementioning

confidence: 99%

Artificial Intelligence Tool and Electronic Systems Used to Develop Optical Applications

Tecpoyotl-Torres¹,

Ochoa²,

Escobedo-Alatorre³

et al. 2010

Advances in Lasers and Electro Optics

View full text Add to dashboard Cite

“…While ablation at 193 nm is possible at high fluences (in excess of 2 J/cm 2 ) the ablation rate is found to depend on the surface roughness and irradiation by multiple pulses can lead to crack formation [1]. Processing of fused silica at 157 nm (F 2 laser) has been performed by a number of groups and interesting applications have been demonstrated [2][3][4][5]. The experimental effort, however, is very high: beam lines have to be evacuated or purged to remove any absorbing oxygen and laser optics have to be all-reflective or made from expensive materials like calcium fluoride.…”

Section: Introductionmentioning

confidence: 99%

Ablation of silicon suboxide thin layers

Jahn

Richter

Weichenhain-Schriever

et al. 2010

Appl. Phys. A

View full text Add to dashboard Cite

We investigate the ablation of SiO x thin films on fused silica substrates using single-pulse exposures at 193 nm and 248 nm. Two ablation modes are considered: front side (the surface of a film is irradiated from above) and rear side (a film is irradiated through its supporting substrate). Fluence is varied from below 200 mJ/cm 2 to above 3 J/cm 2 . SiO x films of thickness 200 nm, 400 nm, and 600 nm are ablated. In the case of rear-side illumination, at moderate fluences (around 0.5 mJ/cm 2 ) the ablation depth corresponds roughly to the film thickness, above 1 J/cm 2 part of the substrate is ablated as well. In the case of frontside ablation the single-pulse ablation depth is limited for all film thicknesses to less than 200 nm even at fluences up to 4 J/cm 2 . Experimental results are discussed in relation to film thickness, fluence, and ablation mode. Simple numerical calculations are performed to clarify the influence of heat transport on the ablation process.

show abstract

Laser shaping of photonic materials: deep-ultraviolet and ultrafast lasers

Cited by 166 publications

References 31 publications

Laser Direct-Write Processing

Laser Direct-Write Processing

Artificial Intelligence Tool and Electronic Systems Used to Develop Optical Applications

Ablation of silicon suboxide thin layers

Contact Info

Product

Resources

About