1981
DOI: 10.1364/cleo.1981.thn5
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Abstract: Laser processing of high circuit density silicon chips is being used for quick turnaround testing of circuit designs. Pulsed dye lasers are currently used to delete connections between devices on chips using standard technology metal lines and S1O2 insulators. Polyimide is a high temperature organic insulator which is finding increasing use in high density silicon chips and in multichip packages. Laser processing of this polyimide material will be discussed.

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