2013
DOI: 10.1007/s00339-013-7909-7
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Laser printing of conformal and multi-level 3D interconnects

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Cited by 38 publications
(16 citation statements)
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“…Out‐of‐plane or 3D structures useful for vertical interconnect applications (known as vias) can be generated with LIFT by repeated transfers over the same location in order to stack each voxel on top of each other . LIFT can also be used to generate 3D microstructures that fold along an edge, thus allowing the printing of interconnects alongside two orthogonal planes on the same substrate . This is accomplished by adjusting the laser energy required to release the voxel from the donor substrate enabling the voxel to fold along the edge of a substrate and thus make contact on two distinct surfaces perpendicular to each other.…”
Section: Applicationsmentioning
confidence: 99%
“…Out‐of‐plane or 3D structures useful for vertical interconnect applications (known as vias) can be generated with LIFT by repeated transfers over the same location in order to stack each voxel on top of each other . LIFT can also be used to generate 3D microstructures that fold along an edge, thus allowing the printing of interconnects alongside two orthogonal planes on the same substrate . This is accomplished by adjusting the laser energy required to release the voxel from the donor substrate enabling the voxel to fold along the edge of a substrate and thus make contact on two distinct surfaces perpendicular to each other.…”
Section: Applicationsmentioning
confidence: 99%
“…Thus, printing of precise patterns by inkjet is very difficult due to the variable behavior of fluids on different types of surfaces and their unstable wetting effects [54,55]. Recently, LIFT has been applied to print high viscosity pastes by laser-decal transfer (LDT) [56][57][58][59][60][61][62][63]. The LDT process is a new type of direct-writing techniques in which voxel shape and size become controllable parameters, allowing the creation of thin-film like structures for a wide range of applications, such as 3D interconnects, free-standing structures, metamaterials, membranes and circuit repair.…”
Section: Printing Of Energy Storage Materials By Laser-induced Forwarmentioning
confidence: 99%
“…40 LIFT has been recently employed to print high viscosity pastes that reproduce the shape of the laser spot. [41][42][43][44][45][46][47] This process, referred to as laser-decal transfer, offers a new approach to direct-writing techniques, in which voxel shape and size become controllable parameters, allowing the generation of thin-film like structures for a wide range of applications, such as 3-D interconnects, metamaterials, free-standing structures, membranes, and circuit repair. The ability to modify the voxel shape and size according to the desired final pattern allows an increase in the resolution and speed of the printing process.…”
Section: Laser-induced Forward Transfer For Micropower Sourcesmentioning
confidence: 99%
“…Details of the LIFT process have been described elsewhere. [41][42][43][44][45][46][47][48][49][50][51][52][53][54][55][56] In the electrode formulation, graphite (KS6) is added to improve the electric conductivity and carbon black (Super P) is added to increase the porosity in the electrode films. The polyvinylidene fluoride hexafluoropropylene (PVDF-HFP) is used as a binder to hold the electrode films onto current collectors.…”
Section: Laser-induced Forward Transfer Of Thick-film Microbatteriesmentioning
confidence: 99%