Laser micromachining for applications in thin film technology

Pfleging, Wilhelm; Ludwig, Alfred; Seemann, K.; Preu, R.; Mäckel, Helmut; Glunz, Stefan W.

doi:10.1016/s0169-4332(99)00468-7

Cited by 28 publications

(13 citation statements)

References 10 publications

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“…Other examples of laser ablation for direct fabrication of MEMS have been reported recently, including machining of shape bimorph actuators in silicon [11], and patterning of multilayer magnetic materials for actuators [12].…”

Section: Laser Micromachining For Direct Fabrication Of Memsmentioning

confidence: 99%

<title>Laser fabrication and assembly processes for MEMS</title>

Holmes

2001

SPIE Proceedings

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This paper discusses the use of high power lasers in the manufacture of microelectromechanical systems (MEMS). The ability to process a wide range of materials, and to produce truly three-dimensional structures with tolerances at the micron or sub-micron level, give laser micromachining some key advantages over other more established micromachining techniques. Previous work in this area is reviewed, covering the following topics: use of ablation in the direct fabrication of MEMS devices and to define polymer masters for subsequent replication by electroforming and moulding (the so-called Laser-LIGA process); laser-assisted deposition and etching on planar and non-planar surfaces; laser-assisted manipulation of microparts and laser-assisted assembly.

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Section: Laser Micromachining For Direct Fabrication Of Memsmentioning

confidence: 99%

<title>Laser fabrication and assembly processes for MEMS</title>

Holmes

2001

SPIE Proceedings

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“…Examples of this technique are a biofactory-on-a-chip (BFC) described below, shaped bimorph actuators in silicon (6) and patterning of magnetic multilayer actuators (7) .…”

Section: Mems Device Structuresmentioning

confidence: 99%

<title>Laser micromachining for manufacturing MEMS devices</title>

Gower¹

2001

MEMS Components and Applications for Industry, Automobiles, Aerospace, and Communication

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“…Particularly, three main strategies have been developed. Firstly, the laser beam is used to locally ablate the dielectric and the contacts are created in a subsequent full-area aluminum deposition and annealing [3][4]. A second approach consists of a metal deposited on top of the dielectric that is laser fired through it leading to the so-called Laser Firing Contacts (LFC).…”

Section: Introductionmentioning

confidence: 99%

Experimental determination of base resistance contribution for point-like contacted c-Si solar cells using impedance spectroscopy analysis

Orpella

Martı́n

López-González

et al. 2015

Solar Energy Materials and Solar Cells

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Abstract:One of the most common strategies in high-efficiency crystalline silicon (c-Si) solar cells for the rear surface is the combination of a dielectric passivation with a point-like contact to the base. In such devices, the trade-off between surface passivation and ohmic losses determines the optimum distance between contacts or pitch. Given a certain pitch, the series resistance related to majority carrier flow through the base and the rear point-like contact (R base ) is commonly calculated a-priori and not crosschecked in finished devices, since typical techniques to measure series resistance lead to an unique value that includes all ohmic losses. In this work, we present a novel method to measure R base using impedance spectroscopy (IS) analysis. The IS data at high frequencies allow to determine R base due to the presence of the capacitor formed by the metal/dielectric/semiconductor structure that covers most of the rear surface. The method is validated by device simulations where the dependence of R base on carrier injection, base resistivity and pitch are reproduced. Finally, R base is measured on finished devices. As a result, a more accurate value of the contacted area is deduced which is a valuable information for further device optimization.

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Laser micromachining for applications in thin film technology

Cited by 28 publications

References 10 publications

<title>Laser fabrication and assembly processes for MEMS</title>

<title>Laser fabrication and assembly processes for MEMS</title>

<title>Laser micromachining for manufacturing MEMS devices</title>

Experimental determination of base resistance contribution for point-like contacted c-Si solar cells using impedance spectroscopy analysis

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