Laser-induced forward transfer of pure metals

Pohl, Ralph

doi:10.3990/1.9789036538695

Cited by 2 publications

(4 citation statements)

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“…A first rough approach to describe the metal heating under laser irradiation can be drawn on the basis of the Drude model [7]. Within this model, the electron scattering mean time is connected to the free electrons gas conductivity by σ = ne 2 τ D /m, with σ being the conductivity, n being the electron density, m being the electron mass, and τ D being the electron scattering mean time, typically a few femtoseconds [7,8,9,10,11]. More rigorous treatments, however, need to consider the specific characteristics of the non-equilibrium electronic distribution [7].…”

Section: Laser-metal Films Interaction: General Considerationsmentioning

confidence: 99%

“…In fact, recent developments in the area of fast and ultrafast pulsed lasers (on the range of nano-, pico-, femto-second) have drawn new and fascinating perspectives in the field of nanofabrication: a multitude of nanostructures can be, currently, produced by exploiting the interaction of lasers with thin films deposited on functional substrates allowing a fine control of shape, size, structure on the basis of the process parameters [7,8,9,10]. The main advantages of the laser-based nanofabrication approach include the ability to manipulate materials with dimensions from the micrometer range to the nanometer one, minimize thermal damage to the substrate and neighboring regions, non-contact nature, non-planar manipulations and the possibility of combining this technique with other fabrication steps such as surface chemical treatments [7,8,9,10,11]. Moreover, a great advantage over other techniques is given by the versatility: by simply choosing the laser characteristics (energy density, wavelength, duration of the pulse, number of pulses), a wide “range” of nanostructures can be generated.…”

Section: Introductionmentioning

confidence: 99%

“…Moreover, a great advantage over other techniques is given by the versatility: by simply choosing the laser characteristics (energy density, wavelength, duration of the pulse, number of pulses), a wide “range” of nanostructures can be generated. Finally, by exploring the interference phenomena obtained from the simultaneous use of two or more lasers, complex periodic arrangements of nanostructures can be fabricated [7,8,9,10,11].…”

Section: Introductionmentioning

confidence: 99%

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Nanostructuration of Thin Metal Films by Pulsed Laser Irradiations: A Review

Ruffino

Grimaldi

2019

Nanomaterials

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Metal nanostructures are, nowadays, extensively used in applications such as catalysis, electronics, sensing, optoelectronics and others. These applications require the possibility to design and fabricate metal nanostructures directly on functional substrates, with specifically controlled shapes, sizes, structures and reduced costs. A promising route towards the controlled fabrication of surface-supported metal nanostructures is the processing of substrate-deposited thin metal films by fast and ultrafast pulsed lasers. In fact, the processes occurring for laser-irradiated metal films (melting, ablation, deformation) can be exploited and controlled on the nanoscale to produce metal nanostructures with the desired shape, size, and surface order. The present paper aims to overview the results concerning the use of fast and ultrafast laser-based fabrication methodologies to obtain metal nanostructures on surfaces from the processing of deposited metal films. The paper aims to focus on the correlation between the process parameter, physical parameters and the morphological/structural properties of the obtained nanostructures. We begin with a review of the basic concepts on the laser-metal films interaction to clarify the main laser, metal film, and substrate parameters governing the metal film evolution under the laser irradiation. The review then aims to provide a comprehensive schematization of some notable classes of metal nanostructures which can be fabricated and establishes general frameworks connecting the processes parameters to the characteristics of the nanostructures. To simplify the discussion, the laser types under considerations are classified into three classes on the basis of the range of the pulse duration: nanosecond-, picosecond-, femtosecond-pulsed lasers. These lasers induce different structuring mechanisms for an irradiated metal film. By discussing these mechanisms, the basic formation processes of micro- and nano-structures is illustrated and justified. A short discussion on the notable applications for the produced metal nanostructures is carried out so as to outline the strengths of the laser-based fabrication processes. Finally, the review shows the innovative contributions that can be proposed in this research field by illustrating the challenges and perspectives.

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Section: Laser-metal Films Interaction: General Considerationsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Nanostructuration of Thin Metal Films by Pulsed Laser Irradiations: A Review

Ruffino

Grimaldi

2019

Nanomaterials

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“…A mold-free time-saving strategy such as computer-controlled laser has been adopted in high-resolution metal patterning recently. Laser-induced forward transfer (LIFT) technology utilizes laser to melt copper and gold to form 3D shape solid metals on the substrate. , However, currently, the metallic pellet heated and forward transferred by laser often shatters or even disintegrates before resolidfication, revealing the difficulty in controlling metal melting and on-demand molding. Fortunately, utilizing laser to pattern room-temperature liquid metals inherently stays away from the poor laser controllability of metal melting, e.g., a liquid metal film can be precisely patterned by laser due to its liquid nature, when being sealed in PDMS or being ablated .…”

Section: Introductionmentioning

confidence: 99%

A Fast and Cost-Effective Transfer Printing of Liquid Metal Inks for Three-Dimensional Wiring in Flexible Electronics

Zhao

Guo

et al. 2020

ACS Appl. Mater. Interfaces

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The fluidity and high electrical conductivity of a liquid metal make it an excellent material for preparing flexible electronics. Here, we established a method utilizing a widespread laser-printing technique to manufacture 3D flexible electronics. Through digital constructing of liquid alloy-philic smooth toner on liquid alloy-phobic rough substrates, we have the liquid metal selectively adhered to the designed pattern. The liquid metal circuit can then be transferred to an uneven and deformable Ecoflex surface to form a 3D circuit. Computational fluid dynamics simulation was performed to interpret the printing mechanism of the liquid metal on a substrate with selected adhesion. Flexible electronics fabricated through this method reveal great performance and stability, opening up opportunities for office and home flexible electronics manufacture, especially for lighting, heating, and logistics. By making the full use of the laser printers, our method not only saves the cost and time in preparation but also identifies favorable prospects for the mature laser-printing industry to promote next-generation flexible electronics fabrication.

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Laser-induced forward transfer as a potential alternative to pick-and-place technology when assembling semiconductor components

Springer

Düsing

Koch

et al. 2021

Journal of Laser Applications

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Fabrication technologies for the semiconductor industry have enabled ever smaller electronic components but now face a fundamental limit in their assembly. As the components get smaller and smaller, the difficulty of assembly increases. At the same time, the number of components per circuit board area is growing, as is the case with LED displays. This in turn calls for an increasing assembly rate. The conventional pick-and-place method can handle approximately 25–30 thousand dies per hour but has increasing limitations when component dimensions are reduced below 150 μm edge length. Laser-induced forward transfer is used as a potential alternative for an assembly of semiconductor components. This technique allows to transfer semiconductor components with an edge length of less than 150 μm to a target substrate. The current process is contactless, damage-free, and has sufficient placement accuracy. If this process is combined with the property of high-pulse repetition rates, it is possible to significantly increase the assembly rate of semiconductor components compared to the current limitations. The aim of this study is to characterize the flight properties of silicon semiconductor components of various dimensions in a laser-driven transfer process using optical imaging methods. This method allows to analyze velocity, the direction of fall, and acceleration of falling components. The results can be used to analyze the transfer behavior of various component sizes and to make estimates of the stability of the transfer process.

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Laser-induced forward transfer of pure metals

Cited by 2 publications

References 111 publications

Nanostructuration of Thin Metal Films by Pulsed Laser Irradiations: A Review

Nanostructuration of Thin Metal Films by Pulsed Laser Irradiations: A Review

A Fast and Cost-Effective Transfer Printing of Liquid Metal Inks for Three-Dimensional Wiring in Flexible Electronics

Laser-induced forward transfer as a potential alternative to pick-and-place technology when assembling semiconductor components

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