2021
DOI: 10.1002/pssb.202000589
|View full text |Cite
|
Sign up to set email alerts
|

Abstract: Herein, a large‐scale fabrication of radio frequency (RF) surface ion traps on a 300 mm glass wafer using a standard foundry process is reported. Established wafer‐level packaging process of electroplated Cu with Au finish is used to fabricate the surface electrodes directly on the glass wafer substrate. A trap is tested by loading it with laser‐cooled 88Sr+ ions. The trap shows a stable operation with RF amplitudes in the range of 100–250 V at 33 MHz frequency. The ion lifetime is on the order of 30 min with … Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1

Citation Types

0
2
0

Year Published

2021
2021
2023
2023

Publication Types

Select...
2
1

Relationship

2
1

Authors

Journals

citations
Cited by 3 publications
(2 citation statements)
references
References 37 publications
0
2
0
Order By: Relevance
“…2(a)) [15]. From the ion trapping experiment, 3 Sr + ions are trapped at the ion-trapped site [16]. As mentioned earlier, focused, integrated photonic components are required for the optical addressing trapped ion in realizing its quantum computing applications.…”
Section: Introductionmentioning
confidence: 99%
“…2(a)) [15]. From the ion trapping experiment, 3 Sr + ions are trapped at the ion-trapped site [16]. As mentioned earlier, focused, integrated photonic components are required for the optical addressing trapped ion in realizing its quantum computing applications.…”
Section: Introductionmentioning
confidence: 99%
“…Similarly, substrates like printed circuit board (PCB), sapphire, quartz and glass were extensively used [45][46][47][48][49]. Due to the limited compatibility to the standard fabrication techniques (e.g., etching), the trap electrode geometries on these dielectric substrates were generally simple and poor at scalability.…”
Section: Technologiesmentioning
confidence: 99%