Lafad‐Assisted Plasma Surface Engineering Processes for Wear and Corrosion Protection: A Review

Adhesion Evaluation of an Embedded SiN/GaAs Interface Using a Novel “Push-Out” Technique

“…Various micro-mechanical testing techniques have been developed to characterize interfacial adhesion. Nanoindentation [ 8 , 9 , 10 , 11 , 12 ], nanoscratch [ 13 , 14 ], and micro-cantilever (MC) and micro-bridge (MB) bending [ 7 , 15 , 16 , 17 , 18 ] are widely used. From these, nanoscratch is considered to be a semi-quantitative approach [ 19 ], whereas top-surface nanoindentation has been used to measure the interfacial strength and toughness of a stiff dielectric film attached onto a comparatively ductile semiconductor substrate [ 19 , 20 ].…”

Evaluation of SOFC Interconnects Made of Ferritic Steels with Nano-Structured Oxi-Ceramic Protective Coatings Deposited by the LAFAD Process

“…6 High chromium ferritic stainless steels also create another problem for SOFC application: Cr poisoning of the cathode. 7,8 To mitigate the TGO growth and eliminate Cr poisoning, different conductive oxide and nitride surface coatings (deposited by a variety of techniques) have been evaluated. 2,[9][10][11][12][13][14][15][16][17][18] One of the more promising compositions is (Co, Mn) 3 O 4 spinel (with Co:Mn -1:1), which can provide the necessary low area surface resistance (ASR) required for this application.…”

“…In these processes, the surface layer is subjected to a high rate of bombardment by energetic ions, which affects the mobility of the depositing metal vapor atoms and in many cases creates metastable structures with unique functional properties. 7,[19][20][21] This approach is especially productive in the deposition of nano-structured and/or nanocomposite coatings with ultra-fine or glass-like amorphous structure. However, conventional EBPVD and MS processes produce metal vapor flow with very low ionization rate, usually less than 1%.…”

“…The direct cathodic arc deposition (DCAD) process produces highly ionized vapor plasma, but suffers from the large quantity of macroparticles or droplets emitted from the evaporation target surface along with atomic neutral vapor particles and ions. 7,19 The filtered cathodic arc deposition (FCAD) process, on the other hand, is able to eliminate unwanted macroparticles, droplets and most of the neutrals from the metal plasma stream generated by cathodic vacuum arc process and can produce nearly 100% ionized, atomically-clean, metal vapor plasma with a relatively high electron temperature of 3-5 eV. The metal ion flow produced by the FCAD process consists of multi-charged ions with large kinetic energy ranging from 40 to 200 eV.…”

“…The metal ion flow produced by the FCAD process consists of multi-charged ions with large kinetic energy ranging from 40 to 200 eV. 7,19 Large Area Filtered Arc Deposition (LAFAD) technology provides a highly productive, robust, industry-friendly process which combines the high productivity rate of conventional DCAD and magnetron sputtering sources, with the capability of generating a nearly 100% ionized metal-gaseous vapor plasma having large kinetic energy and no macroparticles, droplets, multi-atom clusters or other contaminants. 7,22,23 Since the LAFAD plasma source operating pressure regimes overlap with most other conventional vacuum vapor deposition technologies such as magnetron sputtering, EBPVD, thermal evaporation, plasma-assisted chemical vapor deposition (PACVD), it can be used in hybrid processes combining its high deposition and high ionization rates in conjunction with conventional PVD and low pressure PACVD processes as was demonstrated in.…”