Kinetics and driving forces of abnormal grain growth in thin Cu films

Sonnweber-Ribic, Petra; Gruber, Patric A.; Dehm, Gerhard; Strunk, H. P.; Arzt, Eduard

doi:10.1016/j.actamat.2011.12.030

Cited by 64 publications

(33 citation statements)

References 25 publications

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“…In films that are sufficiently thick, (100)-oriented grains grow at the expense of (111) grains, transforming the film to a (100) fiber texture by what has been described as an abnormal grain growth process [2,3]. Since the orientation distribution determines properties, there has been much interest in this texture transformation [2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17].…”

Section: Introductionmentioning

confidence: 99%

“…However, recent studies have questioned the role of both stresses and interface energies in this texture transformation. Where stresses are known with certainty, they have been shown to be insufficient to produce the texture transition [10,11,[15][16][17]. Indeed, even films removed from their substrates and thus nominally stress-free have been observed to transform [10,11].…”

Section: Introductionmentioning

confidence: 99%

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Driving forces for texture transformation in thin Ag films

et al. 2016

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The well-known thickness-dependent (111)-to-(100) texture transformation in thin FCC films is usually attributed to a competition between interface and strain energies. In this model, thin films retain their (111) texture due to the lower energy of the (111) interface, while thick films transform to (100) due to the lower stiffness and thus strain energy of a (100) film. However, recent work has called this model into question, suggesting that neither the stress nor the interface energy play a dominant role in texture transformation. We investigated the driving forces involved in this transformation by using a bulge test apparatus to induce different stresses in thin Ag films under identical annealing conditions. In situ synchrotron XRD measurements show the change in texture during annealing, and reveal that applied stresses have no effect on the transformation. Stress analysis shows that differences in driving forces for texture transformation due to applied bulge pressure were significant (≈200 kJ/m 3 ), suggesting that a different, much larger driving force must be responsible. Reduction in defect energy has been proposed as an alternative. However, vacancy and dislocation densities must be exceptionally high to significantly exceed the strain energy and do not provide obvious orientation selection © 2016. This manuscript version is made available under the Elsevier user license http://www.elsevier.com/open-access/userlicense/1.0/ mechanisms. Nanotwins in reported densities are shown to provide greater driving force (≈ 1000 kJ/m 3 ) and may account for orientation selection. The large difference between the calculated strain and defect energies and the driving force for grain growth (21,100 kJ/m 3 ) casts doubt on the applicability of a simple thermodynamic model of texture transformation.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Driving forces for texture transformation in thin Ag films

et al. 2016

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“…The difference in elastic strain energy density between the grains can appear due to several possible reasons. Since gold is an elastically anisotropic material, some grains will have a lower Young's modulus in the straining direction leading to a lower strain energy density at the same applied external strain [17,18]. Another possibility is that some grains will have a lower Taylor factor and plastic slip will occur at a lower applied stress.…”

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confidence: 99%

“…This driving force is considered to be high enough to cause GB migration and grain coarsening. For comparison, the driving forces responsible for texture transition and recrystallization in thin films were estimated to be below 4x10 5 J/m 3 for copper films [18] and below 10 6 J/m 3 for silver films [19]. Thus, the model presented in Fig.…”

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confidence: 99%

The driving force governing room temperature grain coarsening in thin gold films

Глушко

Cordill

2017

Scripta Materialia

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Strong room-temperature grain coarsening in gold films on polyimide induced by cyclic uniaxial mechanical strain is demonstrated. Detailed electron backscatter diffraction analysis revealed that, in contrast to the predictions of shear-coupled grain boundary migration model, the grain coarsening is isotropic and coarsened grains do not exhibit any specific crystallographic orientations or misorientations to the neighboring grains. It is shown that a thermodynamic model where the driving force appears due to the difference in yield stresses between the grains with different sizes provides an adequate explanation of the experimental data.Room temperature grain coarsening induced by mechanical loading has been shown to occur in Cu [1-3], Pt [4], Ni [5], Al [6][7][8], and Au [9] under different loading conditions such as nanoindentation [1,6], monotonic tensile loading [7,8], fatigue loading [2][3][4]9] as well as beam bending [5]. Despite the large number of experimental evidences, very little is known about the driving forces behind the athermal grain coarsening. In systematic investigations of nanocrystalline Al thin films [7,8] the authors were not able to explain the observed grain coarsening with "traditional driving forces"[7] and it was suggested that shear coupled grain boundary migration (SCGBM) is responsible for the grain growth. However, the SCGBM concept was developed to explain the grain boundary (GB) migration at elevated temperatures in bicrystals with clearly defined GB planes, GB types and misorientations [10][11][12]. In polycrystals, the grain boundaries are often of mixed type and have no coincidence site lattices. Although the SCGBM was generally observed in polycrystals [13,14], the tangential displacement of the grains with respect to the boundary must be restricted due to the constraint caused by the neighboring grains [15]. Thus, it is currently unclear to which extent the SCGBM concept can be applied to explain the grain coarsening effect in real polycrystals. It is necessary to note, that grain coarsening can also occur without GB migration as demonstrated for nanocrystalline Au films [9] where a nanotwin-assisted GB elimination mechanism was proposed.In the present work, a detailed electron backscatter diffraction (EBSD) characterization is utilized to analyze possible driving forces governing severe room temperature grain coarsening in cyclically loaded ultra-fine grained (UFG) gold films.The gold films were deposited on 50 µm polyimide Upilex substrates by electron beam evaporation in a Balzers BAK 550 evaporation machine with the vacuum of 2.1x10 -7 mbar and using a deposition rate of

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“…In the last few decades, there has been a dramatic proliferation of research related to the mechanism of crystal growth, since it affects the properties of crystal structure in the thermal annealing process [7][8][9][10][11][12][13][14][15][16][17]. A lot of research has been done in this field to observe large grain growth [18][19][20][21][22][23][24][25][26][27][28]. The extra-large grain growth in polycrystalline Cu is called abnormal grain growth.…”

Section: Introductionmentioning

confidence: 99%

Anisotropic Grain Growth in (111) Nanotwinned Cu Films by DC Electrodeposition

Shen

et al. 2019

Materials

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We have reported a method of fabricating (111)-orientated nanotwinned copper (nt-Cu) by direct current electroplating. X-ray analysis was performed for the samples annealed at 200 to 350 • C for an hour. X-ray diffraction indicates that the (200) signal intensity increases while (111) decreases. Abnormal grain growth normally results from transformation of surface energy or strain energy density. The average grain size increased from 3.8 µm for the as-deposited Cu films to 65-70 µm after the annealing at 250 • C for 1 h. For comparison, no significant grain growth behavior was observed by random Cu film after annealing for an hour. This research shows the potential for its broad electric application in interconnects and three-dimensional integrated circuit (3D IC) packaging.

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Kinetics and driving forces of abnormal grain growth in thin Cu films

Cited by 64 publications

References 25 publications

Driving forces for texture transformation in thin Ag films

Driving forces for texture transformation in thin Ag films

The driving force governing room temperature grain coarsening in thin gold films

Anisotropic Grain Growth in (111) Nanotwinned Cu Films by DC Electrodeposition

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