2007
DOI: 10.1063/1.2815664
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Iodine enhanced focused-ion-beam etching of silicon for photonic applications

Abstract: Focused-ion-beam etching of silicon enables fast and versatile fabrication of micro-and nanophotonic devices. However, large optical losses due to crystal damage and ion implantation make the devices impractical when the optical mode is confined near the etched region. These losses are shown to be reduced by the local implantation and etching of silicon waveguides with iodine gas enhancement, followed by baking at 300°C. The excess optical loss in the silicon waveguides drops from 3500 to 1700 dB/cm when iodin… Show more

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Cited by 11 publications
(8 citation statements)
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“…The main reason for diminished optical performance of FIB milled structures is the local implantation of Ga + ions. TRIM (transport and range of ions in matter) calculations [13] and previous ion implantations studies in Si predict large number of implanted ions and amorphization of the Si layer [14][15][16]. Ga + ion is known to have a low solid solubility in Si and a low amorphization dose.…”
Section: Resultsmentioning
confidence: 99%
“…The main reason for diminished optical performance of FIB milled structures is the local implantation of Ga + ions. TRIM (transport and range of ions in matter) calculations [13] and previous ion implantations studies in Si predict large number of implanted ions and amorphization of the Si layer [14][15][16]. Ga + ion is known to have a low solid solubility in Si and a low amorphization dose.…”
Section: Resultsmentioning
confidence: 99%
“…Therefore, we attempted to improve the shape of the hole profile by means of insulatorenhanced etching ͑IEE͒ 15,16 in which XeF 2 was used as an assistant gas during FIB etching. Therefore, we attempted to improve the shape of the hole profile by means of insulatorenhanced etching ͑IEE͒ 15,16 in which XeF 2 was used as an assistant gas during FIB etching.…”
Section: Discussionmentioning
confidence: 99%
“…It should be mentioned that the Ga + ion beam employed here is not the ideal ion beam source for etching GaAs/AlGaAs materials, and measurements were therefore performed as a feasibility study, not for benchmarking performance. If a proper gas-assisted FIB milling [54] or He + ion beam technique was to be used, an even better device performance would be expected. But still, as seen from the SEM image (inset of Fig.…”
Section: A Materials and Methodsmentioning
confidence: 99%
“…However, due to the need for expensive masks and repeated processing, development of new devices is costly and time-consuming. It is therefore attractive to use prototyping technologies that enable rapid and flexible fabrication of nanophotonic components, ranging from micro-to nanometer scales [54]. Among these approaches, FIB is an interesting alternative as it allows photoresist-free and direct writing, which enables the post-fabrication of devices with a more complex topography such as ridge waveguides and laser facets.…”
Section: Introductionmentioning
confidence: 99%
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