Introduction and Literature Review

Moukhtar, Ibrahim; Dein, Adel Z. El; Elbaset, Adel A.; Mitani, Yasunori

doi:10.1007/978-3-030-61307-5_1

Cited by 1 publication

(1 citation statement)

References 40 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Over traditional Ball Grid Array (BGA) packaging [8], the main advantage of CSPs technologies is that they save large space. CSP packages are classified into four types [9]: Lead frame (chips are placed on a frame), Rigid (chips rest on a ceramic or laminated substrate), Flex or Tape where chips are placed on a flexible or tape material, and Wafer Level. In this paper, Tape based chip-scale package technology (T-CSP) has been investigated.…”

Section: Introductionmentioning

confidence: 99%

Advanced Reliability Analysis of Mechatronic Packagings coupling ANSYS^©and R

Hamdani

Radi

Hami

2022

Int. J. Simul. Multidisci. Des. Optim.

View full text Add to dashboard Cite

The complexity challenges of mechatronic systems justify the need of numerical simulation to efficiently assess their reliability. In the case of solder joints in electronic packages, finite element methods (FEM) are commonly used to evaluate their fatigue response under thermal loading. Nevertheless, Experience shows that the prediction quality is always affected by the variability of the design variables. This paper aims to benefit from the statistical power of the R software and the efficiency of the finite element software ANSYS©, to develop a probabilistic approach to predicting the solder joint reliability in Mechatronic Packaging taking into account the uncertainties in material properties. The coupling of the two software proved an effective evaluation of the reliability of the T-CSP using the proposed method.

show abstract