2000
DOI: 10.1143/jjap.39.l205
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Interface-Treated Josephson Junctions in Trilayer Structures

Abstract: We have demonstrated interface-treated Josephson junctions without deposited barriers in a trilayer structure. In the junctions, barriers were formed through an etching process and an annealing process for base YBa2Cu3O7-x (YBCO) films. The junctions showed resistively-shunted-junction-type characteristics over the entire temperature range below 70 K. A magnetic field modulation of more than 80% was observed throughout the operating temperature range. The obtained I … Show more

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Cited by 27 publications
(11 citation statements)
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“…The base electrode, the intermediate layer and the counter electrode films with a thickness of about 150-180 nm, 10-30 nm and 100-120 nm, respectively, were epitaxially grown using a target with composition. In order to form barrier layers, it is important that the damage is given to the surfaces of the base electrode and the intermediate layer [13], [14]. The surfaces of these layers were damaged by an Ar ion bombardment in an ECR ion-beam etcher for the barrier formation.…”
Section: Methodsmentioning
confidence: 99%
“…The base electrode, the intermediate layer and the counter electrode films with a thickness of about 150-180 nm, 10-30 nm and 100-120 nm, respectively, were epitaxially grown using a target with composition. In order to form barrier layers, it is important that the damage is given to the surfaces of the base electrode and the intermediate layer [13], [14]. The surfaces of these layers were damaged by an Ar ion bombardment in an ECR ion-beam etcher for the barrier formation.…”
Section: Methodsmentioning
confidence: 99%
“…Details of the junction fabrication process is found elsewhere [4], [5]. Here we describe the sample fabrication process for the TEM observation.…”
Section: Methodsmentioning
confidence: 99%
“…Interface engineering technique provided a promising way to high quality junctions, and has been applied to ramp-edge junctions [1]- [3]. The authors applied this technique to stacked-type junctions, and obtained high product of 2.1 mV (at 4.2 K) and fairly low spread of junction properties about 10% [4] current was often observed, which was considered to arise from the superconducting leak paths in the barrier. The authors introduced a process of (PGO) doping to the barrier to eliminate such leak paths [5].…”
Section: Introductionmentioning
confidence: 99%
“…Until now, many efforts have been exerted in the preparation of heteroepitaxial sandwich-type junctions made of HTS. For the c-axis YBa2C~307.x (YBCO) system, SrTi03 [ 11, BizSr2CuO6, (Bi-2201) [2], Y203 [3], and PrBazCu307, (PBCO) [4], [5] have been used as non-superconducting barrier materials. On the other hand, PBCO [6], [7] and PrGa03 [8] have been adopted for the a-axis YBCO system.…”
Section: Introductionmentioning
confidence: 99%